Additive Technology for 3D-Shapeable Millimeter-Wave Passive Components

毫米波无源元件的性能受到其材料和制造技术的广泛影响，例如无线通信和传感所需要的毫米波无源元件。迫切需要创新的、具有成本效益的、高性能的技术来实现这些组件。该项目旨在探索使用增材制造（即打印技术）经济高效地制造3d成型毫米波无源组件的地面铺设方面。该项目将通过几种不同的打印技术解决单层和多层3d可成形互连和电路的制造问题。该项目将探索印刷介质和印刷金属结构的结合，以及它们对毫米波无源电路元件的要求和性能。它将决定喷墨、点胶和3D长丝打印的可能性和局限性。材料和测试结构将在技术可用性和毫米波性能方面进行深入研究。将设计和表征在30 GHz和140 GHz之间工作的示例结构，将包括各种传输线、天线和平面到波导的转换。

Performance of millimeter-wave passive components, which are needed, for instance, for wireless communication and sensing, is widely influenced by the materials and manufacturing technologies these components are based of. There is a strong need for innovative cost-efficient, high-performant techniques to realize such components. The project aims to explore ground laying aspects for the cost-efficient manufacturing of 3D-shapeable millimeter-wave passive components using additive manufacturing, that is, printing technology. The project will address single-layer and multi-layer manufacturing of 3D-shapeable interconnects and circuits by several different printing technologies. The project will explore the combination of printed dielectric and printed metal structures, together with their requirements and performances for millimeter-wave passive circuit components. It will determine possibilities and limitations of inkjet, dispensing and 3D filament printing. Materials and test structures will be thoroughly investigated with respect to technological usability and millimeter-wave performance. Example structures that will be designed and characterized, for operation between 30 GHz and 140 GHz, will include a variety of transmission lines, antennas and planar-to-waveguide transitions.