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High Speed Slicing by Thin Diamond Wire Tool

High Speed Slicing by Thin Diamond Wire Tool
使用细金刚石线工具进行高速切片
批准号:
13650139
负责人:
SUWABE Hitoshi
金额:
$2.24万
依托单位国家:
日本
项目类别:
Grant-in-Aid for Scientific Research (C)
财政年份:
2001
资助国家:
日本
项目状态:
已结题
起止时间:
2001 至 2003

项目摘要

项目成果

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中文摘要
翻译
到去年为止,研制了φ180μm以下金刚石细丝工具电镀设备和高速运转金刚石线材工具的切割机。并明确了细丝刀具扭距与加工特性的关系。通过材料强度试验和细丝刀具切片试验,对细丝刀具的加工机理进行了研究。结果表明:1.从镀制时间、镀池长度、电流密度等方面考察了细丝工具的最佳电镀条件,提高金刚石颗粒与芯线粘结强度的镀前熔池长度为200 mm,固定金刚石颗粒的镀池长度为200 mm,均匀挤出量的镀后熔池长度为200 mm,电流密度为1.5~2.0×10^3A/m^2.2。钢丝刀的抗拉强度由于横截面的减小而降低到普通金刚石钢丝刀的水平。细丝刀具的绞合强度是普通钢丝刀具的1.5倍。3.从细丝刀具绞距对切片性能的影响来看,绞距为8 mm时,切片效率最高。细丝刀具加工表面的测量结果表明,细丝刀具加工表面的精度与普通钢丝刀具加工表面的精度表现出相同的值。
英文摘要
As the results until last year, the plating apparatus to make thin diamond wire tool under φ180μm and the slicer to run the wire tool at high speed were manufactured for experiment of this research project. And, the relation between twist pitch of the thin wire tool and the processing characteristics were clear. In this year, the processing mechanisms of thin wire tool are examined through the material intensity test and the slicing test of thin wire tool. And, the followings are clear.1.As the results to examine the best plating conditions to thin wire tool from point of the plating time, the plating pool length, the current density, the pre-plating pool length to improve stick strength between diamond grains and core wire is 200mm, the plating pool length to fix the diamond grains is 200mm, the after-plating pool length to make uniform extrusion amount is 200mm, and the current density is 1.5〜2.0×10^3 A/m^2.2.As the results of the intensity test of thin wire tool, the tensile strength of wire tool decreases to the normal diamond wire tool by effect of decrease of the cross section. And, the twist strength of thin wire tool shows the value of 1.5 times to the normal wire tool.3.As the examinations of effect between twist pitch of thin wire tool and slicing characteristics, the slicing efficiency shows the best value at 8mm of twist pitch. It is clear that the many diamond grains act on the processing surface in case of thin wire tool of long pitch.4.As the results of measurement for processing surface, the accuracy of processing surface by the thin wire tool shows same value with the accuracy by the normal wire tool.
期刊论文(9)
专著(0)
科研奖励(0)
会议论文
石川憲一: "細線ダイヤモンドワイヤ工具の工具形状が切断性能に及ぼす影響"2004年度精密工学会春季大会講演論文集. 23-24 (2004)
Kenichi Ishikawa:“细线金刚石线刀具的刀具形状对切削性能的影响”2004 年日本精密工程学会春季会议记录 23-24 (2004)。
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通讯作者:
Ken-ichi IHIKAWA: "Processing Characteristics of Thin Diamond Wire Tool"Proc. of JSGE. 119-120 (2003)
Ken-ichi IHIKAWA:“细金刚石线工具的加工特性”Proc。
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石川憲一: "細線ダイヤモンドワイヤ工具の工具形状が切断性能に及ぼす影響"2004年度精密工学会春季大会学術講演会講演論文集. 23-24 (2004)
Kenichi Ishikawa:“细线金刚石线刀具的刀具形状对切削性能的影响”2004年精密工程学会春季会议学术讲座论文集23-24(2004)。
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石川憲一: "縒り線ワイヤを用いたダイヤモンド電着ワイヤ工具の開発"砥粒加工学会誌. 47,9. 495-500 (2003)
Kenichi Ishikawa:“使用绞线开发金刚石电沉积线工具”,磨料加工学会杂志 47,9 (2003)。
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共 8 条
    Development of high speed plating of diamond wire tool for solar battery wafers and slicing characteristics of diamond wire tool
    • 批准号:
      23560138
    • 项目类别:
      Grant-in-Aid for Scientific Research (C)
    • 资助金额:
      $3.41万
    • 财政年份:
      2011
    • 负责人:
      SUWABE Hitoshi
    • 依托单位:
    海外基金