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Development of high speed processing silicon slicer using diamond wire tool

使用金刚线工具的高速加工硅切片机的开发

基本信息

批准号：
11555046
负责人：
ISHIKAWA Ken-ichi
金额：
$ 5.25万
依托单位：
Kanazawa Institute of Technology
依托单位国家：
日本
项目类别：
Grant-in-Aid for Scientific Research (B)
财政年份：
1999
资助国家：
日本
起止时间：
1999 至 2001
项目状态：
已结题

项目摘要

The diamond wire saw is one of slicing methods to semiconductor materials and hard and brittle materials. And, this slicing system is begun to paid attention for near future slicer to change the multi-wire saw using slurry. The investigators designed to develop the new slicing systems and wire making system of the diamond wire saw. The slicing characteristics and the processing mechanisms were studied by using the normal size diamond wire tool and the newly developed thin wire tool with a small diameter. As the results of development of wire tool and slicer system, the followings are clear;◎ Development of wire tool1. The investigators made success of the thin diamond wire tool of the diameter of 180 μm by using the diamond grains of 30-40 μm and the twisting core wire (two piano wires of the diameter of 58 μm).2. This thin diamond wire tool showed 1.3 times as much as the processing efficiency compared with the ordinary size diamond wire tool.3. As the results of material strength and twist test, the processing wire tension of this thin diamond wire tool had to set on the value of 7,84 N or less.◎ Development of slicing system1. The processing efficiency by means of rotating the workpiece in the slicing was twice as much as the normal slicing (in case of no-rotating workpiece). And, the slicing by rotating the workpiece decreased the surface roughness.2. The saw mark could decrease by setting up asynchronously the reverse time of wire running and workpiece rotating.3. The investigators developed the new slicer for thin wire tool, and the thin wire tool became to be able to run at 200m/min as the wire running speed.

金刚石线锯是半导体材料和硬脆材料的切割方法之一。而且，这种切片系统开始受到关注，为不久的将来切片机改变多线锯使用泥浆。研究人员设计开发了新的金刚石绳锯切割系统和制丝系统。采用常规尺寸金刚石线切割工具和新研制的小直径细金刚石线切割工具，研究了金刚石线切割工具的切割特性和加工机理。作为钢丝工具和切片机系统开发的结果，以下是明确的：研究人员利用直径为30-40 μm的金刚石颗粒和绞合芯线（两根直径为58 μm的钢琴丝）成功地制作了直径为180 μm的细金刚石线工具.这种细金刚石线工具的加工效率是普通金刚石线工具的1.3倍.根据材料强度和扭曲测试的结果，这种细金刚石线工具的加工线张力必须设定在7.84 N或更小的值。在切片中通过旋转工件的方法的加工效率是正常切片（在不旋转工件的情况下）的两倍。并且，通过旋转工件进行切片，降低了表面粗糙度.通过异步设置走丝与工件翻转的反向时间，可以减少锯痕.研究人员开发了用于细线工具的新切片机，细线工具能够以200 m/min的线运行速度运行。