Study on Ratio of Contribution of Heat transfer and Interfacial Phenomena to Ice Adhesion to Cooling Solid Surface

2006年，为了阐明冰粘附到冷却固体表面壁的机制，讨论了传热和界面现象对冰粘附的贡献率。并得出以下结论.去除过程可分为“A型”和“B型”，A型和B型分别表现为弹性和粘弹性.冰与冷却固体表面之间的界面剪切应力（单位面积的冰粘附力）与固体表面能成正比，而与冷却热通量无关.粘附能与表面能成正比. 2007年，首先参照2006年的结果，测定了不同表面状态的样品的剪切应力和表面能的温度依赖性。对于导热系数较高的铜板，讨论了铜表面氧化层对剪切应力的影响。最后，采用表面分析的方法，将宏观尺度场的除冰行为和冰的附着特性在纳米尺度场中进行了分析，使两个尺度场相互耦合。并得出以下结论.剪切应力和表面能随温度的降低而增加，并与两者近似相关.铜表面的氧化层被去除后，新的氧化层立即开始形成，之后，新的氧化层的形成逐渐进行，并阐明了剪切应力与所形成的氧化铜层成分之间的关系.结果表明，两种场的计算结果在定性上基本一致，这是实现纳米尺度场与宏观尺度场耦合的第一步。

In 2006, in order to clarify a mechanism ice adhesion to a cooling solid surface wall, a ratio of contribution of heat transfer and interfacial phenomena to ice adhesion was discussed. And following conclusions were obtained.1. The removal process could be classified into two types, "Type A" and "Type B", Type A and B showed the elastic and viscoelastic behaviors, respectively.2. The shearing stress (ice adhesion force per unit area) at the interface between ice and the cooling solid surface was proportional to the solid surface energy rather than the cooling heat flux.3. The adhesion energy was proportional to the surface energy.4. Contribution of the adhesion energy to the shearing work was clarified.In 2007, at first, considering the results in 2006, temperature dependencies of shearing stress and surface energy of some samples with various surface states were measured. And, for a cupper plate with higher thermal conductivity, influence of an oxide layer formed on the copper surface on shearing stress was discussed. Finally, using a method of surface analysis, ice removal behavior and ice adhesion characteristic in a macro-scale field clarified were also discussed in a nano-scale field to couple both scale fields each other. And following conclusions were obtained.1. Shearing stress and surface energy increased with decrease in temperature, and a correlation with both was obtained approximately.2. Formation of new oxide layer started immediately after the oxide layer was removed from the copper surface, after that, the formation proceeded gradually, and the relationship between shearing stress and composition of copper oxide layer formed was clarified.3. Qualitative agreement with the results obtained in both fields was obtained approximately.From the above, the first step to couple the nano-scale field with the macro-scale field could be shown.