Integrated Cooling Enhancement Technology for Power Electronics

该项目旨在开发一种史无前例的集成冷却增强技术(ICETECH)，用于硅功率电子设备上的碳化硅。Icetech代表着与目前容易失败的包装解决方案的根本背道而驰。该项目旨在阐明磁、热和质量传递之间的基本相互作用，并将其应用于冷却。然后，该项目与SPTS Technologies合作，旨在开发将微通道和高灵敏度集成碳化硅温度传感器集成到芯片中的制造工艺。这一新的制造技术允许使用带有磁性液体塞的两相流来实施革命性的强化冷却概念。

This project aims to develop an unprecedented integrated cooling enhancement technology (IceTech) for silicon carbide on silicon power electronics. IceTech represents a radical departure from current failure-prone packaging solutions. The project aims to elucidate the fundamental interactions between magnetism, heat and mass transfer and apply them to cooling. In partnership with SPTS Technologies, the project then aims to develop fabrication processes for integrating microchannels and highly sensitive integrated silicon carbide temperature sensors into a chip. This novel fabrication technology allows for the implementation of the revolutionary enhanced cooling concept using two-phase flow with magnetic liquid plugs.