3D printer for Additively Manufactured Electronics

数字化、人工智能和工业4.0是制造过程“增材制造电子”（AME）发挥重要作用的关键领域。将电子元件集成到组件中可以开发智能传感器和连接系统，从而提高效率和生产力。AME能够快速进行原型设计和产品开发，使研究机构和公司能够优化其创新流程。AME的定制解决方案和设计自由度支持适应这些前瞻性领域的特定要求。通过购买3D AME打印机，弗赖堡大学的微电子实验室能够使用最先进的制造工艺将其自主开发和制造的专用集成电路（ASIC）转化为复杂的系统。所要求的3D AME打印机将能够实现金属和金属的共集成打印，使用喷墨技术将联合收割机UV固化的介电材料与IR烧结的银纳米颗粒结合起来，以创建高分辨率的电气结构。这种任意三维几何形状的共集成印刷允许以创新的方式实现所制造的ASIC的电接触，同时保护它们免受外部影响。代替普通印刷电路板（PCB）组件中的电气部件的典型平面组合，单个部件的堆叠、正交或甚至球形布置是可能的，从而导致显著更小的形状因子。印刷工艺和较低的制造温度允许暂停印刷，从而允许ASIC的无封装嵌入，即所谓的裸芯片，最大限度地减少了形状因子，并由于消除了键合线和较短的走线而提高了信号质量。此外，导体的布线可以通过将它们完全屏蔽在3D打印的外壳内，将它们扭曲成更大的组或微调它们的阻抗来进行革命性的改变。无源电子元件和3D天线的生产也是可能的，最终实现PCB、无源元件和ASIC融合成一个高度集成的微电子单元。最终，3D AME打印机减少了对外部制造的需求，并扩展了工程学院制造多物理微系统的能力。多物理感知和高度集成的脑机接口研究正在推进。在教育方面，打印机可以提供寄生ASIC效应及其对敏感电路影响的实际经验。

Digitalization, Artificial Intelligence, and Industry 4.0 are key areas in which the manufacturing process "Additively Manufacturing Electronics" (AME) plays a significant role. The integration of electronics into components allows for the development of intelligent sensors and connected systems with increased efficiency and productivity. AME enables rapid prototyping and product development, allowing research institutions and companies to optimize their innovation processes. The tailored solutions and design freedom of AME support adaptation to the specific requirements of these forward-looking areas. By acquiring a 3D AME printer, the Laboratory for Microelectronics at the University of Freiburg is enabled to transform its self-developed and manufactured application-specific integrated circuits (ASICs) into complex systems using state-of-the-art manufacturing processes. The requested 3D AME printer will enable the co-integrated printing of dielectrics and metals, using inkjet technology to combine UV-cured dielectric materials with IR-sintered silver nanoparticles to create high-resolution electrical structures. Such co-integrated printing in arbitrary three-dimensional geometries allows for the electrical contacting of the manufactured ASICs in an innovative way while simultaneously protecting them from external influences. Instead of the typically planar combination of electrical components in common printed circuit board (PCB) assembly, stacked, orthogonal, or even spherical arrangements of individual components are possible, resulting in significantly smaller form factors. The printing process and low manufacturing temperature allow for pausing the printing and thus the package-free embedding of ASICs as so-called Bare Dies, minimizing the form factor and improving signal qualities due to the elimination of bond wires and shorter traces. Furthermore, the routing of conductors can be revolutionized by shielding them entirely within the 3D-printed enclosure, twisting them in larger groups, or finely tuning their impedances. The production of passive electrical components and 3D antennas is also possible, ultimately achieving a fusion of PCBs, passive components, and ASICs into a highly integrated microelectronic unit. In the end, a 3D AME printer reduces the need for external manufacturing and expands the capabilities of the Faculty of Engineering to manufacture multiphysical microsystems. Research on multiphysical sensing and highly integrated brain-machine interfaces is being promoted. In education, the printer enables practical experience with parasitic ASIC effects and their impact on sensitive circuits.