Printer for additively manufactured printed circuit boards and electronics

本提案的主题是采购用于增材制造电路板和增材制造电子产品的系统（“打印机”）。在本领域的当前状态中，常规制造的电路板通常代表关于（量子）传感器系统的可实现的集成密度和可实现的形状因子的瓶颈;因为一方面，它们不能实现集成电路和光电元件的真正3D集成，另一方面，尤其是最小可制造通孔尺寸代表了对可实现的集成密度的强烈限制。印刷电路板的3D打印在可用的自由度方面提供了巨大的优势，这可以用于增加集成密度和提高系统性能-例如，通过印刷过孔的更好的高频特性或通过线圈和线圈阵列的全新概念的可行性。拟议中的设备将主要用于研究对诺埃尔概念的混合微集成的第一代和第二代量子传感器。主要重点将是用于经典核磁共振（NMR）和电子自旋共振（ESR）光谱的感应传感器，以及基于半导体材料（如金刚石和碳化硅）中固态缺陷的传感器。在这里，增材制造的印刷电路板能够实现斯图加特大学智能传感器研究所针对上述应用研究的集成收发器电路的高效和节省体积的连接。此外，精确自旋控制所需的电感结构可以直接地并且以任意三维形式集成到印刷电路板中。这允许灵敏度的潜在改进，并且同时允许改进的形状因子。特别是对于利用动态核极化（DNP）增强自旋灵敏度的NMR实验传感器系统的制造，3D印刷线圈结构可以与收发器电子器件一起直接集成到印刷电路板中，与传统制造方法相比具有巨大的优势。对于基于半导体固态缺陷的量子传感器，除了量子位的磁性控制外，通常还需要光学激发和读出，3D打印PCB可以实现最佳形状因子，同时最大限度地提高电子和光电元件的混合集成性能。

The subject of this proposal is the procurement of a system ("printer") for additively manufactured circuit boards (PCBs) and additively manufactured electronics. In the current state of the art, conventionally manufactured circuit boards often represent the bottleneck with respect to the achievable integration density and the achievable form factor of (quantum) sensor systems; since, on the one hand, they do not enable true 3D integration of integrated circuits and optoelectronic elements, and on the other hand, especially the minimum manufacturable via size represents a strong limitation for the achievable integration density. 3D printing of printed circuit boards offers immense advantages in terms of the available degrees of freedom, which can be used both to increase the integration density and to improve system performance – e.g. through better high-frequency properties of the printed vias or through the feasibility of entirely new concepts for coils and coil arrays. The proposed device will be used mainly for research towards noel concepts for the hybrid microintegration of first- and second-generation quantum sensors. The main focus will be on inductive sensors for classical nuclear magnetic resonance (NMR) and electron spin resonance (ESR) spectroscopy, as well as sensors based on solid-state defects in semiconductor materials such as diamond and silicon carbide. Here, the additively manufactured printed circuit boards enable the efficient and volume-saving connection of the integrated transceiver circuits researched at the Institute of Smart Sensors at the University of Stuttgart for the above-mentioned applications. Moreover, the inductive structures required for a precise spin control can be integrated directly and with arbitrary three-dimensional form into the printed circuit boards. This allows for a potential improvement in sensitivity and, at the same time, an improved form factor. Especially for the fabrication of sensor systems for NMR experiments making use of dynamic nuclear polarization (DNP) for enhanced spin sensitivities, 3D-printed coil structures, which can be directly integrated into the printed circuit board together with the transceiver electronics, offer immense advantages over classical fabrication approaches. For quantum sensors based on solid-state defects in semiconductors, which often require optical excitation and readout in addition to magnetic control of the qubits, 3D-printed PCBs enable an optimal form factor while maximizing performance for hybrid integration of electronic and optoelectronic components.