Printer for additively manufactured printed circuit boards and electronics

本提案的主题是为增材制造电路板（pcb）和增材制造电子产品采购系统（“打印机”）。在目前的技术状态中，传统制造的电路板通常代表了（量子）传感器系统可实现的集成密度和可实现的外形因素方面的瓶颈；一方面，它们不能实现集成电路和光电子元件的真正3D集成，另一方面，特别是可制造的最小通孔尺寸对可实现的集成密度有很强的限制。印刷电路板的3D打印在可用的自由度方面提供了巨大的优势，可用于增加集成密度和改善系统性能-例如，通过印刷过孔更好的高频特性或通过线圈和线圈阵列的全新概念的可行性。该装置将主要用于研究第一代和第二代量子传感器混合微集成的新概念。主要的焦点将是用于经典核磁共振（NMR）和电子自旋共振（ESR）光谱的电感传感器，以及基于半导体材料（如金刚石和碳化硅）中固态缺陷的传感器。在这里，增材制造的印刷电路板可以实现斯图加特大学智能传感器研究所研究的集成收发器电路的高效和节省体积的连接，用于上述应用。此外，精确自旋控制所需的感应结构可以直接以任意三维形式集成到印刷电路板中。这允许在灵敏度的潜在改进，同时，一个改进的形状因素。特别是对于核磁共振实验传感器系统的制造，利用动态核极化（DNP）来增强自旋灵敏度，3d打印线圈结构可以直接集成到印刷电路板中，与收发器电子器件一起，比传统的制造方法提供了巨大的优势。对于基于半导体固态缺陷的量子传感器，除了量子比特的磁控制外，通常还需要光激发和读出，3d打印pcb可以实现最佳形状因素，同时最大限度地提高电子和光电子元件混合集成的性能。

The subject of this proposal is the procurement of a system ("printer") for additively manufactured circuit boards (PCBs) and additively manufactured electronics. In the current state of the art, conventionally manufactured circuit boards often represent the bottleneck with respect to the achievable integration density and the achievable form factor of (quantum) sensor systems; since, on the one hand, they do not enable true 3D integration of integrated circuits and optoelectronic elements, and on the other hand, especially the minimum manufacturable via size represents a strong limitation for the achievable integration density. 3D printing of printed circuit boards offers immense advantages in terms of the available degrees of freedom, which can be used both to increase the integration density and to improve system performance – e.g. through better high-frequency properties of the printed vias or through the feasibility of entirely new concepts for coils and coil arrays. The proposed device will be used mainly for research towards noel concepts for the hybrid microintegration of first- and second-generation quantum sensors. The main focus will be on inductive sensors for classical nuclear magnetic resonance (NMR) and electron spin resonance (ESR) spectroscopy, as well as sensors based on solid-state defects in semiconductor materials such as diamond and silicon carbide. Here, the additively manufactured printed circuit boards enable the efficient and volume-saving connection of the integrated transceiver circuits researched at the Institute of Smart Sensors at the University of Stuttgart for the above-mentioned applications. Moreover, the inductive structures required for a precise spin control can be integrated directly and with arbitrary three-dimensional form into the printed circuit boards. This allows for a potential improvement in sensitivity and, at the same time, an improved form factor. Especially for the fabrication of sensor systems for NMR experiments making use of dynamic nuclear polarization (DNP) for enhanced spin sensitivities, 3D-printed coil structures, which can be directly integrated into the printed circuit board together with the transceiver electronics, offer immense advantages over classical fabrication approaches. For quantum sensors based on solid-state defects in semiconductors, which often require optical excitation and readout in addition to magnetic control of the qubits, 3D-printed PCBs enable an optimal form factor while maximizing performance for hybrid integration of electronic and optoelectronic components.