Development of Virtual Reliability Design Methodology for Interconnections Involved in Microelectronics and Optoelectronics

本项目的目标是建立一个虚拟的可靠性设计方法，包括新的测量方法，基于扫描电子显微镜（SEM）和扫描探针显微镜（SPM），用于验证先进的微电子和光电子的核心材料模型。提出在充分认识小尺寸AuSn共晶焊点的力学、物理、蠕变、疲劳和断裂特性的基础上，建立统一的粘弹塑性关系、断裂准则和疲劳寿命预测模型。该数据库将为建立数字方法提供坚实的基础。此外，在材料模型中将考虑高温蠕变和低温断裂。它还提出了基于SEM和/或SPM的实验测量技术，所谓的SEM莫尔和microDAC和/或nanoDAC，将被开发用于确定微/纳米变形。前者是基于SEM光栅产生和光学倍增技术的结合，后者是基于SEM和/或SPM成像和数字相关技术的结合。与现有的测量技术相比，这些技术将实现更高的测量灵敏度（纳米）和空间分辨率（微米）。根据所提出的材料模型，建立有限元模型，并通过所提出的测量技术进行验证。其结果是，一个虚拟的可靠性设计方法将实施微电子和光电子互连应用。

The objektive of this project is to establish a virtual reliability design methodology, including new measurement methods, based on scanning electron microscope (SEM) and scanning probe microscope (SPM), for validation of core material models to be developed for advanced microelectronics and optoelectronics. lt is proposed that a unified visco-elasto-plasticity relationship, a fracture criterion, and a fatigue life prediction model will be established, based on fully understanding of mechanical, physical, creep, fatigue and fracture properties of small AuSn eutectic solder joints. The data-base will provide a solid basis for the establishment of numerical approaches. Moreover, high temperature creep and low temperature fracture will be taken into consideration in the material models. lt is also proposed that SEM- and/or SPM-based experimental measurement techniques, so-called SEM-moire and microDAC and/or nanoDAC, will be developed for the determination of micro-/nano-deformation. The former is based on the combination of the SEM grating Generation and optical multiplication technique and the later is based on the combination of SEM and/or SPM imaging and digital correlation technique. With these techniques, much higher measurement sensitivity (in nanometer) and spatial resolution (in micrometer) will be achieved than that with current measurement techniques. lt is also proposed that finite element models will be established, based on the proposed material models, and verified by the proposed measurement techniques. As a result, a virtual reliability design methodology will be implemented for both microelectronics and optoelectronics interconnection applications.