Integrated Interconnects in Data Centres and High-Performance Computing

在数据中心和高性能计算中，需要高速互连来以省时、省电且经济高效的方式链接、传输、检索和处理密集型数据。该项目旨在研究高速、集成的互连，包括在硅平台上的新型集成设备和收发器、灵活的子系统和整体系统架构。研究成果将有利于集成芯片和电路设计与制造、集成系统和网络基础设施等多个行业，并将为云计算、传感、信号处理和计算健康提供更快的平台。

High-speed interconnects are needed to link, transmit, retrieve, and process intensive data in a time- and energy-efficient and cost-effective manner in data centres and high-performance computing. This project aims to investigate high-speed, integrated interconnects, including novel integrated devices and transceivers on silicon platforms, flexible subsystems and overall system architecture. The research outcomes will be beneficial to a number of industries including integrated chip and circuit design and fabrication, integrated systems, and network infrastructures, and will enable faster platforms for cloud computing, sensing, signal processing, and computational health.