Terahertz Imaging for Side-Channel Attacks

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This project aims to employ terahertz waves to extract sensitive information from integrated circuits, as a means of side-channel attack. The concept is founded upon exceptional sensitivity of terahertz waves to the dynamics of free carriers, i.e., electrons and holes, in semiconductors. This prospect is fostered by the ability of terahertz waves to propagate through nonmetallic chip packaging and to provide sub-millimetre spatial and depth resolutions. Noncontact terahertz probing of a live chip will deliver raw data, i.e., leakage, that can be processed by statistical tools to infer secret information through cryptographic engineering. This project will explore this leakage to assess potential risks and propose effective countermeasures.