QuILT - Quantum element Interposition by Laser Transfer

电信已成为全球人类生活中最重要的部分之一，并继续扩大和增加其对我们的生活以及商业化和工业进步的影响。随着通信渠道和数据量的不断增加，信息安全持续面临风险。数据加密方法和算法正在进步，但落后于拦截系统和代码的发展。此外，随着量子计算的进步，我们期待着量子启示录的到来，在这种情况下，传统计算手段的加密将是不够的。在量子计算普及之前，对传输的数据进行低成本的量子加密，并将其集成在符合个人电子技术规范的简单、低功耗和小尺寸的设备中，将变得至关重要。被子项目旨在通过引入制造步骤来简化量子密钥分配器(QKDS)和其他量子纠缠光子发射设备中量子发射器的实现，以满足这一需求。目前，利用量子纠缠的设备需要超导体和低温系统，而在基于光子的纠缠的情况下，创建具有多个主动层和被动层的复杂器件的纠缠光子发射的概率很低。Quilt将允许将光子纠缠能力直接应用于光子或光电子设备，而不会冒险或改变制造商正在遵循的当前工艺。这种方法使用公认的LIFT(激光诱导前向转移)过程在简单或复杂的光子集成或半导体器件上沉积量子点，并使器件能够进行基于量子纠缠的操作。这一过程也可以应用于硫化物量子点，这些量子点已经被证明可以提高纠缠光子的产生效率。该工艺的可行性将在低成本硅片上湿法刻蚀二氧化硅器件上进行测试，纠缠光子发射将被先进的传感器捕获并使用概率算法进行分析。被子技术解决方案旨在解决使量子器件的结构复杂化并使其大规模使用和引入更广泛的工业甚至消费市场非常昂贵的技术问题的核心。因此，我们可以在半导体和微电子行业习惯的微型芯片尺寸中构建器件，还可以观察微电子的成本模型，从而使它们能够集成到商业设备中。

Telecommunications has become one of the most vital part of human life globally and continues to expand and increase its impact on our lives and as a result on commercialisation and industrial progress. Information security is continuously at risk as the communication channels and data volumes continue to increase. Data encryption methods and algorithms are advancing but lag behind the evolution of intercepting systems and codes. Moreover, with the advancement of quantum computing we are at anticipation of the quantum apocalypse, where encryption by conventional computing means will be inadequate. Quantum encryption of transmitted data, at low cost and integrated in simple, low power consumption and small size devices that match personal electronics specifications will become of paramount importance before the point where quantum computing becomes available to everyone. The QuILT project aims at addressing this need by introducing a manufacturing step to simplify the implementation of quantum emitters in Quantum Key Distributor (QKDs) and other quantum entangled photon emission devices.The current state of the art in devices that utilise quantum entanglement requires superconductors and cryogenic systems while in the case of photonic based entanglement, complex device creation with multiple active and passive layers suffers from low probability of entangled photon emission. QuILT will allow for photonic entanglement capability to be applied directly on photonic or opto-electronic devices without risking or changing the current processes being followed by the manufacturer. The approach, using the well-established LIFT (Laser Induced Forward Transfer) process to deposit quantum dots on simple or complex photonic integrated or semiconductor devices and enable devices for quantum entanglement based operation. The process can also be applied on chalcogenide quantum dots which have been proven to increase efficiency in entangled photon generation. The process feasibility will be tested on low cost wet etched silica on silicon wafer device and entangled photon emission will be captured by advanced sensors and analysed with probabilistic algorithms.The QuILT technology solution aims at the heart of the technical issues that complicate the construction of quantum devices and make them very expensive for mass use and introduction to the wider industrial or even consumer market. Devices can thus be constructed in the miniature chip size that we are used to from the semiconductor and micro-electronics industry, and also observe the cost models of microelectronics, hence allowing their integration into commercial appliances.