Packaging of novel Ultra-dyNamiC pHotonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems

PUNCH通过开发一种新的光交换模式，为时间确定性和时间敏感性网络提供了一种解决方案，该模式（I）打破了灵活性和灵活性之间的权衡，（超动态可重构性）和决定论（II）通过激活带宽引导来减少拥塞，使得可以在网络中的热节点之间分配附加容量;（III）通过进一步实现具有快速可重新配置能力的时域中的多路复用来提供无与伦比的动态和带宽效率。一个2×2× 8 λ波长选择开关元件将被扩展为一个完全无阻塞的8 × 8 × 8 λ和16 × 16 × 8 λ可重构光交换结构。用于微转移印刷兼容的半导体光放大器的III-V族铸造工艺的开发使得能够在硅光子学平台上实现无损耗的光开关。用于驱动、控制和功率监控缩放交换机结构的定制配置电子IC将与光子IC密集集成到异构扇出晶圆级封装中，并在200 mm重建晶圆平台上进行处理。此外，光子IC的光学接口将使用光学重分布层来实现，在高密度有机基板上提供光学扇出，并允许可扩展的光纤封装解决方案。新的集成和封装工艺将用于制造1.6 Tbit/s光收发器，提供光开关和电子资源（计算，内存和存储）之间的接口。光交换机和收发器原型将在5G RAN传输网络中进行演示，用于TSN前传应用和数据中心的内存分解。

PUNCH offers a solution for time-deterministic and time-sensitive networks by developing a new optical switching paradigm which (I) breaks the trade-off between flexibility (ultra-dynamic reconfigurability) and determinism (guaranteed latency and jitter) by offering an all-to-all reconfigurable interconnect; (II) reduces congestion by activating bandwidth steering so that additional capacity can be allocated between hot nodes in the network; (III) provides unparalleled dynamics and bandwidth efficiency by further enabling multiplexing in the time domain with fast reconfigurable capability. A 2×2×8Lambda wavelength selective switching element will be scaled to a fully non-blocking 8x8x8Lambda and 16x16x8Lambda reconfigurable optical switch fabric. The development of a III-V foundry process for micro-transfer-printing-compatible semiconductor optical amplifiers enables loss-less optical switching on a silicon photonics platform. Custom configuration electronic ICs to actuate, control, and power-monitor a scaled switch fabric will be densely integrated with the photonic ICs into a heterogeneous fanout wafer-level package, processed on a 200mm reconstructed wafer platform. In addition, the optical interfacing to the photonic ICs will be accomplished using an optical redistribution layer, providing an optical fanout on high density organic substrates, and allowing for a scalable optical fiber packaging solution. The novel integration and packaging processes will be applied for manufacturing 1.6 Tbit/s optical transceivers providing the interface between optical switches and electronic resources (compute, memory, and storage). The optical switch and transceiver prototypes will be demonstrated in a 5G RAN Transport Network, for TSN Fronthaul applications and for memory disaggregation in data centers.