HiPE - High Performance Power Electronics Integrations

HiPE汇集了涵盖整个价值链的13个参与者，为下一代电池电动汽车（BEV）开发新的高能效，高成本效益，模块化，紧凑和集成的宽带隙（WBG）电力电子解决方案，并促进WBG在汽车行业的重大市场渗透。该项目的产出将包括：i）基于WBG的牵引逆变器和DC/DC转换器的可扩展和模块化系列，具有显着改进的特定冷却性能，适用于400 V，800 V和1200 V应用，额定功率为50至250 kW，集成到电力驱动器中，可大幅减小尺寸和重量; ii）一系列集成的基于WBG的车载充电器和DC/DC转换器，具有优化的创新拓扑结构，包括使用GaN;以及iii）用于高压附件和底盘致动器的集成的、容错的和具有成本效益的GaN基功率电子器件。其结果将是前所未有的功能集成水平，例如，HiPE电力电子解决方案将是智能网络物理系统，包括智能和预测控制器优化性能，创新和计算效率高的数据驱动方法监控相关硬件的健康状态，以及基于数字孪生的新方法，根据每个BEV上安装的硬件的特定条件定制组件和车辆级算法，并主动控制相关部件的可靠性和可用性。这将在保持预期的汽车质量水平的同时实现，而不必求助于过度工程，这要归功于数据驱动的网络物理系统可靠性技术的创新实施。与设计和实验活动并行运行的广泛仿真分析将进一步展示电力电子解决方案的可扩展性，模块化和更广泛的潜在影响

HiPE brings together 13 participants covering the whole value chain, to develop a new highly energy-efficient, cost-effective, modular, compact and integrated wide band gap (WBG) power electronics solutions for the next generation of battery electric vehicles (BEV), and to facilitate a significant market penetration of WBG in the automotive sector. The project outputs will include: i) a scalable and modular family of WBG-based traction inverters and DC/DC converters with significantly improved specific cooling performance, suitable for 400V, 800V and 1200V applications, with power ratings from 50 to 250 kW, integrated into electric drives enabling drastic size and weight reductions; ii) a family of integrated WBG-based on-board chargers and DC/DC converters, with optimised innovative topologies, including use of GaN; and iii) integrated, fault-tolerant and cost-effective GaN-based power electronics for high-voltage ancillaries and chassis actuators. The result will be an unprecedented level of functional integration, e.g., the HiPE power electronics solutions will be smart cyber-physical systems, incl. intelligent and predictive controllers to optimise performance, innovative and computationally efficient data-driven approaches to monitor the state-of-health of the relevant hardware, as well as novel digital-twin-based methodologies to tailor the component- and vehicle-level algorithms to the specific condition of the hardware installed on each individual BEV, and actively control the reliability and availability of the relevant parts. This will be achieved while preserving the expected automotive quality level without having to recur to over engineering, thanks to the innovative implementation of data-driven dependability techniques for cyber-physical systems. The extensive simulation analyses running in parallel with the design and experimental activities will further demonstrate the scalability, modularity and wider potential impact of power electronics solutions