Detailed Characterisation of Tetrivis Ku-Band Phased Array Tx and Rx RFICs for Low Earth Orbit Satellite (LEOSAT)

愿景：在2020年至2021年之间，Tetrivis将自筹资金设计、验证和有限的硅原型/制造两个射频集成电路（RFIC）——TRV003，一个库波段（10.7GHz至12.75GHz）相控阵接收器（Rx） RFIC，在同一芯片上集成了四个双波束和双极化（X+Y）接收器路径，以及TRV004。ku波段（14GHz至14.5GHz）相控阵发射机（Tx） RFIC也在同一芯片上集成了四个双波束和双偏振（X+Y）发射机路径。这两款芯片都是晶圆级封装，模球间距为171um，这对英国PCB供应商来说是一个极具挑战性的尺寸。因此，PCB模具附加问题和资金限制阻碍了我们实现项目的下一个里程碑，即两个RFIC芯片的详细实验室特征。该项目将使Tetrivis能够解决贴片PCB问题，修改RFIC PCB安装策略，并对两个RFIC进行详细的RF实验室表征。rfic的设计是为了满足英国、欧盟、亚洲和美国卫星公司对低地球轨道卫星（LEOSAT）地面站相控阵智能天线使用Tx和Rx rfic的新兴和不断增长的需求。主要目标：-与分包商合作解决PCB模具连接问题，并实现RFIC球与PCB之间的一致连接-与分包商合作为RFIC加工散热片-与分包商合作为使用同一PCB的多个RFIC特性定制RFIC插座-开发用于编程RFIC内部寄存器的图形用户界面软件-采购二手射频设备以帮助RFIC特性过程-开发软件创新：通过灵活、低功耗、低面积和低成本的RFIC解决方案同时支持ku波段和ka波段频谱的能力是设计创新之一。由于时间限制，实施了有限的ka波段支持，并将进行测试。此外，RFIC设计的Rx路径能够承受比接收的Rx信号高M个数量级的耦合Tx信号，同时仍然提供前所未有的载波噪声干扰比（C/N+I），这是RFIC设计要解决的重大架构、系统和电路设计挑战。最后，TRV003和TRV004 RFIC硅在最佳工艺技术节点中实现，使高产量硅器件具有适度的成本开销，从而战略性地定位RFIC器件，用于未来的大规模生产和商业化。

Vision:Between 2020 and 2021, Tetrivis self-funded the design, verification and limited silicon prototyping/fabrication of two Radio-Frequency Integrated Circuits (RFIC) - the TRV003, a Ku-Band (10.7GHz to 12.75GHz) Phased-Array Receiver (Rx) RFIC integrating four dual-beam and dual-polarised (X+Y) receiver paths on the same die, and the TRV004, a Ku-Band (14GHz to 14.5GHz) Phased-Array Transmitter (Tx) RFIC also integrating four dual-beam and dual-polarised (X+Y) transmitter paths on the same die.Both chips were Wafer-Scale-Packaged with die ball pitch being 171um, a dimension that was extremely challenging for UK PCB vendors to work at. PCB die-attach issues and funding limitations thus prevented us from achieving the next milestone in the project, which was the detailed laboratory characterisation of the two RFIC chips.This project will enable Tetrivis address the die-attach PCB issues, revise RFIC PCB mounting strategy and carry out detailed RF laboratory characterisation of the two RFICs. The RFICs were designed to meet the emerging and ever increasing demand by UK, EU, Asian and American satellite companies for Tx and Rx RFICs for use in their Low-Earth-Orbit Satellite (LEOSAT) Earth-Station Phased-Array Smart Antennas.Key Objectives:- To work with sub-contractor to address PCB die-attach issues and achieve consistent connectivity between RFIC balls and PCB- To work with sub-contractor to machine Heat-Sink for RFICs- To work with sub-contractor to make custom RFIC sockets for multiple RFIC characterisation using the same PCB- To develop the Graphical User Interface software for programming the RFIC internal registers- To procure second-hand RF Equipment to aid RFIC characterisation process- To develop software to aid Automated characterisation of RFICs- To carry out detailed RF characterisation of RFICsInnovation:The capability to simultaneously support Ku-Band and Ka-Band spectra with an agile, low-power, low-area and low-cost RFIC solution is one of the design innovations. Limited Ka-Band support was implemented due to time constraints and will be tested.In addition, the ability of the Rx path of the RFIC design to tolerate a coupled Tx signal of M orders of magnitude higher than the Rx signal being received whilst still delivering unprecedented Carrier-to-Noise-and-Interference-Ratio (C/N+I) is the significant architectural, systematic and circuital design challenge that the RFIC design addresses.Finally, the TRV003 and TRV004 RFIC silicon were implemented in an optimal process technology node which enables high-yielding silicon devices with moderate cost overhead, thus strategically positioning the RFIC devices for future mass production ramp-up and commercialisation.