ELCOSINT – Electronic Component Sintered Interconnections

ELCOSINT项目将开发用于电子组件的新型聚合烧结互连材料，专门用于取代高pb含量材料，并进一步提高电子组件的工作温度。英国在苛刻的恶劣环境应用（如航空航天、井下钻井、汽车和电源管理）中拥有重要的高价值制造基地。多学科项目团队将开发电子元件互连的材料和制造工艺，使用纳米银基材料在元件和基板之间形成连接。该技术将与标准微电子制造工艺兼容，从而实现快速采用。将设计和生产一种高温传感器放大器演示器，该演示器将允许对开发进行表征、评估和鉴定，从而能够快速生产可靠、健壮的电子系统。

The ELCOSINT project will develop novel polymeric, sintered interconnection materials for electronic assemblies specifically designed to replace high-Pb content materials and further increase the operating temperature of electronic assemblies. The UK has a significant high value manufacturing base in demanding harsh environment applications such as aerospace, down hole drilling, automotive and power management. The multi-disciplinary project team will develop the materials and manufacturing process for electronic component interconnection using nano-silver based materials to form joints between components and substrates. The technology will be compatable with standard microelectronics manufacturing process enabling fast take up. A high temperature sensor amplifier demonstrator will be designed and produced that will allow the characterisation, assessment and qualification of the developments to enable rapid production of reliable, robust electronic systems.