Advanced PACKaging EnABLing FuturE Technologies (PACKABLE)

“无论是在家中、工作场所还是在我们所依赖的企业和组织中，通信和数据传输方面的技术进步都越来越明显。在过去的5年里，我们已经开始将智能手机、平板电脑、视频通话、智能电视、社交媒体和云存储视为理所当然。随着我们对现有互联网技术和新兴物联网（IoT）的使用迅速增加，我们正在经历前所未有的带宽增长。思科在其第12届VNI年度报告（2016年）中预测，到2021年，地球仪将有46亿互联网用户和271亿网络设备和连接。带宽增长受到互连网络中心的光通信设备的成本和性能的限制。当前的数据中心互连解决方案维持每波长每秒100 Gbps，这不足以满足未来的需求。业界已确定1000 Gbps（每秒1 T比特）的目标，以满足2021年及以后的需求（http：//ethernetalliance.org/roadmap）。具有数字信号处理（DSP）的光子集成电路（PIC）是领先的带宽解决方案，具有提供每秒1 T比特（Tbps）数据吞吐量的巨大潜力。然而，新解决方案的商业可行性在很大程度上取决于成本。这包括技术本身的成本，以及它与现有基础设施的兼容性。新的解决方案必须符合严格的尺寸标准，以使产品能够与现有的基础设施一起使用。当前最先进的设备封装将无法满足DCI市场未来的成本、性能和尺寸要求。我们的项目，“先进的包装，使未来的技术”（PACKABLE），将提供一种新颖的、具有成本效益的紧凑型封装解决方案，可实现> 1 Tbps的数据吞吐量。我们将使用我们的专利紧凑型封装技术来满足未来的成本、性能和尺寸标准，该技术比现有的封装解决方案便宜15倍。此外，我们将利用英国的技术专长和知识产权，开发创新技术，使包装制造工艺适应高温处理，使我们能够利用现有的低成本，大批量，我们的封装还将与各种应用兼容，如医疗、航天、国防、能源、运输和建筑领域使用的硅光子和光纤传感器。到2023年，光DCI的全球市场预计将达到64.1亿美元（复合年增长率10.04%）（DCI Market 2017-2022，www.businesswire.com，Aug 17），因此，利用这种多部门封装解决方案对我们项目团队中的英国价值链中小企业来说是一个非常重要的机会。"

"Technological advances in communication and data transfer are increasingly visible all around us, at home, at work and in the businesses and organisations that we all depend on. In the last 5 years we have started to take our smartphones, tablets, video calling, Smart TVs, social media, and cloud storage for granted. With our rapidly increasing use of existing Internet technology and the emerging Internet of Things (IoT), we are experiencing unprecedented bandwidth growth. In their 12th annual VNI report (2016), Cisco forecast that by 2021, there will be 4.6 billion internet users and 27.1 billion networked devices and connections across the globe.Bandwidth growth is constrained by the cost and performance of the optical communication devices that interconnect datacenters. Current datacenter interconnect solutions sustain 100 Gigabits per second (Gbps) per wavelength, which is not adequate for future demand. The industry has identified a target of 1000Gbps (1Terabit per second) to satisfy demand in 2021 and beyond (http://ethernetalliance.org/roadmap).Photonic Integrated Circuits (PICs) with Digital Signal Processing (DSP) is the leading bandwidth solution, demonstrating great potential to deliver data throughput of 1 Terabit per second (Tbps).However, the commercial viability of new solutions is largely dependent on cost. This includes the cost of the technology itself, and its compatibility with existing infrastructure. New solutions must comply with stringent size criteria to allow products to be used with existing infrastructure.Current state of the art device packaging will not meet the DCI market's future cost, performance, and size requirements. Our project, ""Advanced PACKaging EnABLing FuturE Technologies"" (PACKABLE), will deliver a novel, cost-effective and compact packaging solution which will enable \>1Tbps data throughput.We will meet future cost, performance and size criteria using our patented compact packaging technology, which is 15X cheaper than existing packaging solutions.Moreover, we will exploit UK technical expertise and IP to develop innovative techniques to adapt the packaging manufacturing process for high temperature processing, enabling us to use existing lower cost, high volume, semiconductor IC manufacturing lines.Our packaging will also be compatible with diverse applications such as silicon photonics and fibre optic sensors used in medical, space, defence, energy, transport and construction sectors. The global market for optical DCI alone is projected to reach US$6.41Bn by 2023 (CAGR 10.04%) (DCI Market 2017-2022, www.businesswire.com, Aug17), so the exploitation of this multi-sector packaging solution represents a very significant opportunity for the UK value chain SMEs in our project team."