ECHiPCHeP - Electronics Cooling via Hi Performance Coated Heat Pipes

热管对高性能硅芯片的热管理至关重要，几乎出现在每一台新的笔记本电脑中。Thermacore是热管技术的世界领先者，专门从事军事应用等高性能电子设备的热管理。为了保护和扩大其在高端市场的地位，Thermacore Europe(TCE)和牛津纳米系统公司(ONS)与布鲁内尔大学(BU)共同发现了一种机会，通过用高性能纳米涂层取代或增强当前的内部蒸发冷却表面来提高热管的最大热流密度。包括更高的功率、更轻的重量和更低的成本在内的预期好处将使英国保持在这一高价值电子市场领域的领先地位，并使合作伙伴能够扩展到热量和能源管理的新领域。

Heat Pipes are vital to the thermal management of high performance silicon chips and are present in virtually every new laptop computer. Thermacore is a world leader in heat pipe technology and specialises in thermal management of high performance electronic devices such as for military applications. To protect and expand its position at the high end of the market, Thermacore Europe (TCE) and Oxford nanoSystems (ONS) have, with Brunel University (BU), identified an opportunity to improve the maximum heat flux of a heat pipe by replacing or augmenting the current internal evaporative cooling surface with a high performance nano-coating. The expected benefits including higher power, lower weight and lower cost will allow the UK to maintain its lead in this high value part of the electronics market and the partners to expand into new areas of heat and energy management.