EAGER: Combined Innovative Methods in Immersion Cooling for High Density Power Electronics

EAGER：高密度电力电子设备浸入式冷却的组合创新方法

• 批准号: 1937732
• 负责人: Al-Thaddeus Avestruz
• 金额: $ 16.97万
• 依托单位: Regents of the University of Michigan - Ann Arbor
• 依托单位国家: 美国
• 项目类别: Standard Grant
• 财政年份: 2019
• 资助国家: 美国
• 起止时间: 2019-09-01 至 2024-02-29
• 项目状态: 已结题
• 来源: https://www.nsf.gov/awardsearch/showAward?AWD_ID=1937732&HistoricalAwards=false
• 关键词: EAGER; Combined; Innovative; Methods; Immersion

The miniaturization of power electronics is a key obstacle in the advancement and proliferation of electric aircraft and vehicles. Electrification of transportation helps safeguard the environment and mitigates climate change. The power density and consequently the miniaturization of power electronics is ultimately limited by the ability to remove heat. More effective and reliable cooling mechanisms for heat sources with small surface area are needed. For example, power semiconductor switches that have the highest power density are directly connected without packaging offering the lowest cost, failure rate, and thermal resistance. These advantages are often undone by inadequate thermal transfer from the surface of the chip. Immersion cooling is known to provide the most reliable and highest performance thermal interface for chip-scale devices; however, conventionally, immersion cooling relies on gravity-dependent (physical-orientation dependent) convection or physical pumping, which limits its application and miniaturization in aviation and mobile applications. Ultimately, the goal of this project is to create a high reliability sealed cooling system with no moving parts. This project will help to support of undergraduate research for women and underrepresented minorities and to uncover new concepts for the classroom in the thermal management of power electronics.The goal of this proposal is to investigate combined methods and materials to greatly enhance the performance of immersion cooling without boiling. This will involve: (1) investigating the combined cooling mechanisms that involve different physics that have not been previously examined and modeled; (2) using new combinations of measurement methods to quantitatively determine the conditions under which the effective heat transfer coefficient is improved; and (3) quantitatively determining the stability of new immersion cooling materials under thermal and physical stress. New materials that undergo phase change without boiling will be studied. Measurement methods will include Schlieren imaging using markers for flow and temperature and direct measurement of the channel temperature of gallium nitride semiconductor devices.This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the Foundation's intellectual merit and broader impacts review criteria.

电力电子器件的小型化是电动飞机和电动汽车发展和普及的关键障碍。交通运输电气化有助于保护环境，减缓气候变化。功率密度以及由此导致的电力电子器件的小型化最终受到散热能力的限制。对于小表面积热源，需要更有效、更可靠的冷却机制。例如，具有最高功率密度的功率半导体开关直接连接而无需封装，从而提供最低的成本、故障率和热阻。这些优点往往被芯片表面的热传递不足所抵消。浸没冷却已知提供最可靠和最高性能的热接口的芯片级设备；然而，传统的浸入式冷却依赖于重力（物理方向依赖）对流或物理泵送，这限制了其在航空和移动应用中的应用和小型化。最终，这个项目的目标是创造一个高可靠性的密封冷却系统，没有移动部件。该项目将有助于支持妇女和代表性不足的少数民族的本科研究，并为电力电子热管理的课堂发现新的概念。本提案的目标是研究结合的方法和材料，以大大提高浸泡冷却的性能，而不是沸腾。这将涉及：(1)研究涉及不同物理的组合冷却机制，这些机制以前没有被研究和建模；(2)采用新的测量方法组合，定量确定提高有效换热系数的条件；(3)定量测定新型浸没冷却材料在热应力和物理应力下的稳定性。将研究不经沸腾而发生相变的新材料。测量方法将包括使用流量和温度标记的纹影成像，以及直接测量氮化镓半导体器件的通道温度。该奖项反映了美国国家科学基金会的法定使命，并通过使用基金会的知识价值和更广泛的影响审查标准进行评估，被认为值得支持。