Monolithic Microwave Integrated Circuit (MMIC) design, fabrication and characterisation for 5G telecommunication application using GaN

随着4G视频流等新兴技术对不断增加的无线数据容量的大量需求，预计4G无线网络将在2020年左右开始出现拥塞。这将需要向5G技术必须实现的毫米波频段转移。本研究的目的是识别、表征、设计、制造和实验验证适合集成到5G基站（和/或移动）收发器解决方案中的基于GaN的半导体组件。这些组件必须完全满足未来5G网络的技术性能要求。(a)透过5G用例个案研究，厘清5G前端的系统架构及子电路模块。(b)对所有MMIC组件的要求应基于但不限于系统效率要求；有源器件功率要求的偏置电压选择；发射和接收功放增益，实现5G网络所需的信号覆盖；放大器/混频器带宽，以促进bbb1gbs -1数据速率；确定合适的载波频率和器件技术，以实现具有高q因子和频谱纯度的本地振荡器；产生散热要求，允许识别基板和IC封装技术的实施。(a)利用分析和电路/EM建模定性表征单个MMIC GaN有源和无源器件，并预测其集成到5G收发器时的性能(b)单个组件的制造和实验验证，以便生成GaN器件的代表性模型，用于AWR微波办公室（或ADS）内的5G收发器设计。(a)基于目标1开发的系统架构完成5G收发器的设计。a和目标2.b中生成的模型。通过EM模拟键合线寄生电抗减轻预期的性能下降。(b)在制造前完成最终的电磁分析，以提供对系统性能的最佳预测。这是为了确保目标1中的要求。B已经满足，以增加第一次通过成功的设计的可能性。(c)制造并验证MMIC晶圆的性能。(d)将各个mmic打包并验证其绩效，确保符合目标3.b.4。)对5G用例的最终MMIC设计进行实验研究，以演示bbb1gbs -1数据速率。预期结果预期实现所列出的目标，从而实现研究的目的，将导致能够在类似于5G网络预测用例的情况下发射和接收高带宽（bbb1gbs -1）数据的5G收发器的成功演示。通过分析和模拟（目标2）实现的定性器件建模应与从制造的MMIC器件的实验验证中收集的数据（目标3）一致。这将确认MMIC设备的设计理念，以便将其作为未来5G设备开发的蓝图提交给工程界或任何工业合作伙伴。

IntroductionWith the prolific demand for ever increasing wireless data capacity coming from emerging technologies such as 4Kvideo streaming, it is predicted that 4G wireless networks will begin experiencing congestion around 2020 [1]. Thiswill require a shift in to the millimetre wave band that 5G technology must accomplish.AimThe aim of this research is to identify, characterise, design, fabricate and experimentally validate GaN basedsemiconductor components suitable for integration in to 5G base-station (and/or mobile) transceiver solutions.These components must fully meet the technical performance requirements of future 5G networks.Objectives1.) (a) With the aid of case studies of 5G use-cases, the system architecture and sub-circuit blocks of a 5G front endare to be identified. (b) Requirements for all MMIC components should be based on but not limited to systemefficiency requirements; bias voltage selection for active device power requirements; transmit and receivepower-amplifier gain to achieve the signal coverages required by 5G networks; amplifier/mixer bandwidth tofacilitate > 1 Gbs-1 data-rates; identification of a suitable carrier frequency and device technology to implementlocal oscillators with high Q-factors and spectral purity; Generation of thermal dissipation requirementspermitting identification of the substrate and IC packaging technology implemented.2.) (a) Utilise analytics and circuit/EM modelling to qualitatively characterise the individual MMIC GaN active andpassive devices and predict their performance when integrated in to a 5G transceiver (b) Fabrication andexperimental validation of the individual components such that representative models of the GaN devices canbe generated for use in the design of the 5G transceiver within AWR Microwave Office (or ADS).3.) (a) Complete the design of a 5G transceiver based on the system architecture developed in Objective 1.a and themodels generated in Objective 2.b. Mitigate the expected degradation in performance by EM simulation bondwire parasitic reactance. (b) Complete a final EM analysis to provide the best prediction of system performancebefore fabrication. This is to ensure the requirements in Objective 1.b have been met and to increase theprobability of a first-pass successful design. (c) Fabricate and validate the performance of the MMIC wafers. (d)Package the individual MMICs and validate their performance ensuring agreement with the Objective 3.b.4.) Perform an experimental study of the final MMIC design for a 5G use-case to demonstrate in particular > 1 Gbs-1 data-rates.Intended OutcomesIt is intended that accomplishment of the objectives listed and thus the aim of the research will result in thesuccessful demonstration of a 5G transceiver capable of both transmitting and receiving high bandwidth (> 1 Gbs-1)data in circumstances analogous to the predicted use-cases of 5G networks. The qualitative device modellingachieved through analytics and simulation (0bjective 2) should be in agreement with the data collected fromexperimental validation of the fabricated MMIC device(s) (Objective 3). This will serve as confirmation of the designphilosophy of the MMIC device(s) such that it can be presented to the engineering community or any industrialpartners as a blueprint for the development of future 5G devices.