Nanoscale 3D transfer printing for hybrid photonic device fabrication

芯片级光子系统已经在从芯片上实验室生物传感器到超高速微显示器和光子集成电路的广泛应用中得到了快速的吸收。这种新功能的爆炸式增长是由成熟的芯片级平台（包括III-V族、硅、有机物和玻璃）的可用性实现的。材料平台的商业化以及现有制造技术的利用，特别是来自集成电子领域的技术，使研究人员能够探索光电器件的大规模集成。

Chip scale photonic systems have seen a rapid uptake in a wide range of applications from lab-on-a-chip biosensors to ultra-high speed micro-displays and photonic integrated circuitry. This explosion of new functionalities has been enabled by the availability of mature chip scale platforms, including III-V's, silicon, organics and glass. The commercialization of the material platforms, and the leveraging of existing fabrication technologies, notably from the integrated electronics community, has enabled researchers to explore large scale integration of optoelectronic devices.