Development of a semi-automated laser bonding system and the associated novel assembly method for power devices

“这是一个电气工程的博士研究项目。博士项目旨在开发一种基于激光的键合系统，该系统具有良好的控制力应用，视觉和对准能力，适用于微系统组装应用，特别是用于高温应用的电力电子器件以及其他高温器件（MEMS和传感器）。这项研究是EPSRC资助的一个主要研究项目的关键部分，该项目正在与格拉斯哥大学合作开发GaN高功率晶体管的新型组装和互连方法。该项目的一部分是设计和建造一个装置，以便更好地控制和监测粘合过程。第二个领域是对集团正在开发的一些新型粘合工艺进行实验验证，并探索新的应用，例如传感器设备，一些可行性工作正在与一家公司进行。”

"This is a PhD research project in electrical engineering.The PhD project aims to develop a laser based bonding system with well controlled force application, vision and alignment capability for microsystem assembly applications, in particular power electronic devices for high temperature applications as well as other high temperature devices (MEMS and sensors). The research is a key part of a major ongoing EPSRC funded research project on development of novel assembly and interconnection methods for GaN high power transistors in collaboration with Glasgow University where the devices are being developed. One part of the project is in design and construction of a setup that allows better control and monitoring of the bonding process. The second area is experimental validation of some novel bonding processes being developed in the group and explore new applications for example sensor devices, some feasibility work is being conducted with a company. "