Nanoscale thermal management

问题：所有电子设备和电路都会产生多余的热量，因此需要热管理来提高可靠性并防止过早失效。在微电子和纳米电子学中，对于更小、更高效的元件来说，热通常是一个限制因素。传统的散热器使用铜，然而它的导热系数k=~400 Wm-1K-1，虽然在金属中是最高的，但不足以克服现代微电子产生的不断增加的热量。针对性的技术解决方案：石墨烯在热管理方面具有最大的潜力。它在室温下是优良的导热体。它的导热系数是所有已知材料中最高的，k=~2000-4000 Wm-1K-1。重要的是，生产成本低于传统的铜散热器。包括石墨烯热管理在内的电子产品将从其散热和优化电子功能的能力中受益匪浅。因此，石墨烯（以及其他具有优异导热性的二维材料）在这类应用中具有巨大的潜力。商业应用的一些关键例子包括：i) cryory在pc散热器上引入了其CPU石墨烯增强冷却系统。它是目前可用的高端处理器中最小的冷却器；ii)最近华为发布了Mate 20 X游戏和Mate P30 Pro主流智能手机，采用石墨烯薄膜冷却技术进行热管理。从那时起，尽管热管理领域的学术活动有限，但专利活动有所增加。没有相关的计量方法。目的：建立一种适用于各种尺度的二维材料导热系数的定量测量方法，并将其推向国家物理实验室的测量服务。

Problem: All electronic devices and circuitry generate excess heat and thus require thermal management to improve reliability and prevent premature failure. In micro- and nano-electronics, heat is often a limiting factor for smaller and more efficient components. Traditional heat sinks use copper, however its heat conductance, k=~400 Wm-1K-1, though among the highest in metals, is not sufficient to overcome the ever-increasing heat generated by modern microelectronics. Targeted technical solution: Graphene has the highest potential in thermal management. It is an excellent heat conductor at room temperature. Its thermal conductivity is the highest of any known material, k=~2000-4000 Wm-1K-1. Importantly, the production cost is lower than the one for traditional copper heat sinks. Electronics, which includes graphene-enabled thermal management, will greatly benefit from its ability to dissipate heat and optimize electronic function. Thus, graphene (and other 2D materials with exceptional thermal conductivity) holds an enormous potential for this kind of applications. Some key examples of commercial applications include: i) Cryorig has introduced its CPU graphene-enhanced cooling system on the heatsink for PCs. It is the smallest cooler for higher-end processors available today; ii) recently Huawei announced its Mate 20 X gaming and Mate P30 Pro mainstream smartphones, which adopted a graphene film cooling technology for heat management purposes. Since then, the patenting activity has picked up, despite limited academic activity in the area of thermal management. The relevant metrological approach is absent. Objective: to develop a method for quantitative measurements of thermal conductivity in 2D materials applicable to a range of scales and advance it towards NPL measurement service.