Integration of Wide Bandgap semiconductors for Embedded Motor Drives

该项目将解决在嵌入式驱动器中使用宽带隙半导体的潜在好处，主要任务是分析：-低损耗开关器件对效率的影响。-分析使用多极电机在功率转换器划分方面的好处。-分析使用多极电机相对于更高功率密度的好处。-通过使用更多的极对和增加电基频来分析电机功率密度的增加。-研究热管理和减少开关损耗和减少散热器尺寸的权衡。-检查使用更高的开关频率和对输入滤波器尺寸和成本的影响。-创建一份报告，概述上述内容，作为技术门户，以确定实际演示的前进路线。-开发一个演示程序，在实践中探索上述开发的权衡和算法。该研究项目将主要集中于探索功率半导体和无源器件的不同拓扑安排，以促进功率转换器与电机的集成，从而节省典型推进系统中的大量材料和电缆。这些不同的拓扑结构将利用宽带隙半导体的快速开关、低损耗和高温性能，以减小功率转换器的尺寸。拓扑研究还应考虑电机的要求，减轻和控制宽带隙可能引起的高dV/dT应力的破坏性影响。封装和集成半导体、无源和电机绕组的新方法也将被考虑，以实现集成驱动结构的成本效益方法。

The project will address the potential benefits of using wide bandgap semiconductors within embedded drives, key tasks to analyse:- Effect of low loss switching devices on efficiency.- Analyse the benefits of using multi-pole motors with respect to partitioning of power converters.- Analyse the benefits of using multi-pole motors with respect to higher power density.- Analyse any motor power density increases by using higher number of pole pairs and increased electrical fundamental frequency.- Look into the thermal management and tradeoff with reduced switching losses and reduced heatsink size.- Examine the use of higher switching frequencies and the effect on the input filter size and cost.- Create a report outlining the above to be used as a technology gate to decide the route forward to real demonstration.- Develop a demonstrator to explore in practice the tradeoffs and algorithms developed above.This research project will mostly focus on exploring different topological arrangements of power semiconductor and passive devices to facilitate the integration of the power converter with the electrical machine thus saving significant material and cabling in a typical propulsion system. These different topologies will utilize the fast switching, low loss, and high-temperature capabilities of wide band gap semiconductors in order to reduce the size of the power converter. The topological research shall also consider the requirements of the motor and mitigate and control the damaging effects of the high dV/dT stress that the wide band-gap can potentially cause. New methods of packaging and integration of semiconductors, passives and motor windings will also be considered to enable cost effective ways to realise the integrated drive structures.