Advanced modelling and simulation of smart power ICs and packages for operation at 225 C in automotive Electronics (ADAM-SPICE)

由于政府要求快速减少发动机排放，高温硅电子产品在发动机控制单元(ECU)等汽车控制应用中变得越来越必要。传统汽车和混合动力汽车的ECU都是由多芯片模块(MCM)组成的，反映了数字、模拟和电源功能的要求。然而，尽管近年来取得了改进，MCM仍存在长期的可靠性问题。用功率IC取代这些芯片，功率IC在一个芯片上内置了双极模拟、CMOS数字和电源功能，将产生高度紧凑、重量轻和低成本的ECU。然而，据我们所知，这样的功率IC技术即使存在，也是非常少的，它可以在42V下工作，并保持200摄氏度或更高的温度要求。用于器件建模、电路参数提取以及器件和电路布局规则的现有设计软件工具仅适用于最高175摄氏度的温度。这就需要开发模型(经验、数学和SPICE)，并为汽车应用中在高温(225摄氏度)下运行的硅智能功率IC建立低压和高压半导体器件组件和封装的设计标准。快速发展的设计方法、模拟和建模工具将能够：(A)缩短设计周期时间；(B)降低成本；(C)使部件和组件长期可靠；(D)缩短上市时间。

High Temperature Silicon electronics are becoming increasingly necessary for automotive control applications such as Engine Control Units (ECU) because of government requirements to rapidly reduce engine emissions. The ECUs in conventional and hybrid cars are made of multi-chip modules (MCM), reflecting the requirements of digital, analog and power functions. However, MCMs suffer from long term reliability issues, despite improvements made in recent years. Replacing these with power ICs, which have bipolar analog, CMOS digital and power functions built onto one chip will result in highly compact, lightweight and low cost ECUs. However, to our knowledge, very few, if any, such power IC technologies exist, which can operate at 42 V and sustain the temperature requirements of 200 degreeC or more. The available design software tools for device modelling, circuit parameter extraction, and the rules for device and circuit layout are applicable for temperatures only up to 175 degreeC. This necessitates development of models (empirical, mathematical and SPICE) and establish design criteria for low and high voltage semiconductor device components and packages for Si smart power ICs operating at high temperatures (225 degreeC) in automotive applications. Rapidly developing design methodologies, simulation and modelling tools will enable (a) reduction of design cycle time (b) reduce cost and (c) enable long term reliability of components and packages, and; (d) shorten time to market.