Merged logic-memory architectures and applications
Merged logic-memory architectures and applications
批准号:
203575-2006
负责人:
Elliott, Duncan
金额:
$2.19万
依托单位:
依托单位国家:
加拿大
项目类别:
Discovery Grants Program - Individual
财政年份:
2007
资助国家:
加拿大
项目状态:
已结题
起止时间:
2007-01-01 至 2008-12-31
中文摘要
逻辑增强型存储器被证明可以提高各种数字系统的功耗、性能和成本。除了集成更多功能来构建片上系统(SoC)的明显优势外,逻辑增强型存储器提供的内部存储器带宽需要数十或数百个标准存储器芯片才能匹配。通过更有效地利用存储器周期和减少芯片间通信来节省电能。我的实验室使用逻辑增强型存储器的两种方式是用于单指令流多数据流(SIMD)计算和用于互联网路由。计算RAM就是这样一种SIMD并行处理器架构,它已经获得专利,授权给加拿大工业界,并已商业化。这一现有架构是否适合新的应用将被确定。该架构上的变体将设计用于多个应用。最近,通过与麻省理工学院林肯实验室的合作,我们制造了一个三维集成电路,并受邀参与未来他们的3D SOI IC工艺的运行。由于衬底没有电连接到绝缘体上的硅电路,可以通过蚀刻去除衬底,许多晶片上的电路可以堆叠成小体积。所有对键合焊盘的需求被层与层之间1.5微米的小过孔所取代。需要许多新的架构来充分利用这一新的IC技术。三值内容可寻址存储器(TCAM)是一种流行的存储互联网路由表地址前缀并高速搜索它们的解决方案。在向每个单元的存储器阵列添加逻辑时,我们正在评估一种替代方案,该方案需要最优的存储器位数(一半加一)来实现相同的任务,需要更少的晶体管,并且搜索速度更快。为了在互联网的主干中进行大容量路由,我们正在研究一种逻辑增强型存储器,它可以并行地搜索大量分组的路由条目。*逻辑增强型内存在带宽、功耗和系统性能方面具有优势。
英文摘要
Logic enhanced memories are being shown to improve power consumption, performance and reduce cost of various digital systems. Beyond the obvious advantage of integrating more functions to build a system on a chip (SoC), logic enhanced memories offer internal memory bandwidths that would require tens or hundreds of standard memory chips to match. Power is saved by making more effective use of memory cycles and reducing inter-chip communication. Two ways my lab employs logic-enhanced memories are for Single Instruction stream Multiple Data stream (SIMD) computing and for internet routing. Computational RAM is one such SIMD parallel processor architecture, which has been patented, licenced to Canadian Industry and commercialized. Suitability of this existing architecture will be determined for new applications. Variations on this architecture will be designed for a number of applications. Through a collaboration with MIT Lincoln Labs, we had one 3-dimensional integrated circuit built and have been invited to participate in future runs of their 3D SOI IC process. Because the substrate is not electrically connected to the silicon-on-insulator circuits, the substrate can be removed through etching and the circuits from many wafers can be stacked in a small volume. The need for bonding pads is replaced by small 1.5 micrometre vias between layers. New architectures are required to fully exploit this new IC technology. Ternary Content Addressable Memories (TCAMs) are a popular solution for storing internet routing table address prefixes and searching them at high speed. In adding logic into the memory array at each cell, we are evaluating an alternative that requires the optimal number of bits of memory (half plus one) to achieve the same task, requires fewer transistors and performs searches faster. For high capacity routing in the backbone of the internet, we are investigating a logic-enhanced memory that can search for route entries for a large number of packets in parallel. Logic enhanced memories have advantages in bandwidth, power consumption and system performance.
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会议论文
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国内基金
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项目类别:外国学者研究基金项目
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资助金额:--
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依托单位:
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资助金额:--
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