Integrated superconducting optoelectronics for single photon quantum sensing

利用量子现象在集成电路或模块中结合光子和电子器件的技术是为集成量子光电系统的实际实现提供有前景的平台的关键。超导作为一种宏观量子现象，展示了量子隧穿、量子干涉、量子相变和量子光响应等量子效应在电子和光电子器件中的应用。SIS（超导体-绝缘体-超导体）结、SQUIDs（超导量子干涉器件）、超导辐射热计和超导单光子光学探测器是此类器件的重要例子。结合这些量子特性及其独特的电磁行为（超低电阻率和磁通量的绝缘和量子化），超导电子和光电器件可用于超低噪声/超低功耗和超快/高频的电子和光电功能，如检测、混频、放大和开关。超导量子电子和光电子器件在量子传感、量子计量、片上电路腔量子电动力学和量子信息处理器等领域的应用具有很高的需求。总体研究计划将涉及利用集成超导无源和有源光电子器件进行超灵敏量子光子传感。该研究项目将包括理论分析、设计方法的发展和计算模拟，并为制造布局和性能评估方法提供建议。

Technology allowing the combination of photonic and electronic devices in an integrated circuit or module to take advantage of quantum phenomena is the key to providing a promising platform for practical realization of integrated quantum optoelectronic systems. Superconductivity as a macroscopic quantum phenomenon demonstrates the exploitation of quantum effects such as quantum tunneling, quantum interference, quantum phase transition and quantum photoresponse in electronic and optoelectronic devices. SIS (Superconductor-Insulator-Superconductor) junctions, SQUIDs (Superconducting Quantum Interference Devices), superconducting bolometers and superconducting single-photon optical detectors are paramount examples of such devices. Combining these quantum characteristics with their unique electromagnetic behavior (ultra-low electrical resistivity and magnetic flux insulation and quantization), superconducting electronic and optoelectronic devices can be employed for ultra-low-noise/ultra-low-power and ultra-fast/high-frequency electronic and optoelectronic functions such as detection, mixing, amplification and switching. Superconducting quantum electronic and optoelectronic devices are now in high demand for applications in quantum sensing, quantum metrology, on-chip circuit cavity quantum electrodynamics and quantum information processors.The general research proposal will involve the utilization of integrated superconducting passive and active optoelectronic devices for ultra-sensitive quantum photonic sensing. The research program will involve theoretical analyses, development of design methodologies, and computational simulation with recommendations for fabrication layout and methods of performance evaluation.