Development of 3D strain gauge sensor for structural health monitoring of aging critical systems

该项目的重点是一个新的基于微机电系统（MEMS）的传感器的原型阶段，用于结构健康远程监测（SHM）应用的三维应力/应变测量。验证的传感机制，利用硅压阻元件，构建一个微型传感芯片，可以监测三维应力和应变的应变结构表面。一个微组装倒装芯片技术被用来构建这个SHRM芯片使用电子电路，遥测系统，和电源到一个微封装的传感芯片，可以与远程监控站进行无线通信。这种结构健康远程监测（SHRM）技术为目前市场上可用的微应变计增加了许多好处。MEMS应变传感器（1）是CMOS兼容的，用于与无线和数据处理电路的精细间距集成，（2）以持久的较低功耗（1- 50 mW）工作，（3）能够以增强的远/近场应变比进行感测，以及（4）具有独特的3D应力/应变提取能力，以监测导致传感器脱粘的面外应力。提出的基于MEMS的应变传感技术的初步概念已被验证的分析和实验。这个I2 I第一阶段的提案将专注于准备一个原型，可用于传感芯片的β场测试。随着这一阶段的成功，我们计划在第二阶段推进我们的商业化计划。传感芯片将通过与大学商业化办公室合作的公司分拆进行商业化。具有广阔的潜在市场，几个工业团体表示有兴趣和支持在阿尔伯塔的油砂开采设备和应变测量系统上部署MEMS应力传感器。

This project focus on the prototyping phase of a new Micro-Electro-Mechanical-System (MEMS)-based sensor for 3D stress/strain measurements intended for Structural Health Remote Monitoring (SHM) applications. The verified sensing mechanism utilizes silicon piezoresistive elements to construct a micro sensing chip that can monitor the 3D stresses and strains on a strained structure surface. A micro assembly flip chip technique is utilized to construct this SHRM chip using electronic circuitry, telemetry system, and power source into one micro-packaged sensory chip that can communicate wirelessly with a remote monitoring station. This structural health remote monitoring (SHRM) technology adds many benefits to the micro strain gauges currently available in the market. The MEMS strain sensor (1) is CMOS compatible for fine pitch integration with wireless and data processing circuitry, (2) operates with durable lower power consumption (1-50mW), (3) is able to sense with enhanced far/near field strain ratio and (4) has a unique capability of 3D stress/strain extraction to monitor out-of-plane stresses responsible for sensor de-bonding. The initial concept of the proposed MEMS- based strain sensory technique has been verified analytically and experimentally. This I2I phase I proposal will focus on preparing a prototype that can be used for beta field testing the sensory chip. With the success of this phase, we plan to move forward with our commercialization plan through Phase II. The sensory chip will be commercialized through a company spin-off in collaboration with the university commercialization office. With a wide potential market, where several industrial parties has expressed their interest and support in deploying the MEMS stress sensor on their oil sands mining equipment and strain measurement systems in Alberta.