In-chip communication using UWB for 3D integration

当前的趋势是将许多功能(语音、视频和数据)和许多不同的技术(数字、射频、模拟和光学)集成到一个称为融合系统的新产品类别中。这一趋势可以通过四种方法来体现：片上系统(SOC)、多芯片模块(MCM)、封装中系统(SIP)和封装上系统(SOP)。3D集成电路中的体系结构提供了一种性能良好、功耗较低的汇聚系统，即多合一封装。为了通信的目的，系统内的芯片或芯片之间必须有互连。无线互连已经被证明优于集成电路中的有线通信，因为它为多功能集成电路提供了更高的速度、更紧凑和更低的成本。

The current trend toward a new class of products called convergent system integrates many functions (voice, video and data) and many different technologies (digital, RF, analog and optical) into one. This trend can be visualized with four approaches: system-on-chip (SOC), multichip module (MCM), system-in-package (SIP) and system-on-package (SOP). The architecture in 3-D integrated circuits provides a convergent system, the many-in-one package, with good performance and less power. There must be interconnections between the dies or chips within the system for communication purposes. Wireless interconnection has been proven outperforming the wire communication in the ICs since it provides high speed with more compact and lower cost for multi-function IC's.