Wireless Integrated Circuits for the Era of 6G: System-in-a-Package

该项目的目标是使用硅和化合物半导体技术的组合，为未来的无线集成电路建立硬件基础。该项目将产生电路设计和系统集成的知识，以转向新兴的6G技术工程。预期结果包括使用多种半导体技术的收发信机封装，以及主权设计能力的开发。这一结果将构成实施6G的重要一步。为澳大利亚带来的好处包括早期职业工人的发展、知识产权的产生，以及通过应用这种下一代技术为澳大利亚人确保社会和经济利益。

The aim of this project is to build a hardware foundation for future wireless integrated circuits, using a combination of silicon and compound semiconductor technologies. The project will generate knowledge for circuit design and system integration to pivot towards the engineering of emerging 6G technology. Expected outcomes include a transceiver-in-package using multiple semiconductor technologies and the development of sovereign design capabilities. The results will constitute an important step towards implementing 6G. Benefits for Australia include the development of early career workers, generation of intellectual property, and securing social and economic benefits for Australians through application of this next-generation technology.