Low-Cost Wireless Transmitter with Compact Package for Industrial Sensing

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This project aims to provide a solid foundation for silicon-based transmitter design with beam-steering capability operating beyond 100 GHz. The project expects to advance knowledge in low-cost radio-frequency integrated circuit design with miniaturised packaging technology for use in industrial sensing. Expected outcomes of this project include a prototype consisting of a miniaturised 140-GHz phased-array transmitter with packaged antenna arrays, along with a developed selection guideline to choose the "best" silicon-based technology node for cost-effective design. This should provide benefits for organisations working on wireless sensing technologies and lead to new ways of using these technologies for a variety of emerging applications.