Scalable manufacturing of miniature opto-electronic devices and assemblies

硅光子学（SiPh）是一个新的技术创新领域，目标是将信息的节能光学传输与硅器件的计算能力紧密结合。这种与微电子芯片紧密互连的光通信层的范例将增加带宽和数据通信速度，以及显著降低当前计算机的功耗。业界普遍认为，SiPh技术的重大市场渗透的主要技术障碍是封装和组装工艺成本和限制。与IBM加拿大合作的这项CRD赠款的研究项目将专门解决对成功实施SiPh产品至关重要的关键封装方面。该项目的主要目标是显著改善先进SiPh器件封装中使用的制造工艺，以提供高吞吐量、具有成本效益的组装技术。这一目标将通过更多的基础研究（材料表征，数值建模）和制造技术研究（纤维对齐和粘合，先进的工艺表征，有效的微元件连接等）的结合来实现。

Silicon photonics (SiPh) is a new field of technological innovation targeting the tight integration of the energy-efficient optical transport of information with the computational power of silicon devices. Such a paradigm of an optical communication layer that is intimately interconnected to microelectronic chips would increase bandwidth and data communication speeds, as well as significantly lower the power consumption of current computers. The general consensus in the industry is that a major technical hurdle to significant market penetration of SiPh technologies is packaging and assembly process costs and limitations. The research project proposed for this CRD grant with IBM Canada will specifically address critical packaging aspects that are important for the successful implementation of SiPh products. The main goal of this project is to significantly improve the manufacturing processes used in the packaging of advanced SiPh devices, to deliver high-throughput, cost-effective assembly technologies. This goal will be achieved by a combination of more fundamental studies (material characterization, numerical modeling) and manufacturing technology research (fiber alignment and bonding, advanced process characterization, efficient microcomponent attachment, etc.).