Topological wave manipulation in hybrid integrated platforms

该项目旨在建立一个功能强大的工具包，用于处理与层状2D材料接口的光子系统中的拓扑波。这项研究将解决一个重要的问题，即为了可靠和紧凑的信号处理而使光子组件小型化。尺寸的减小将通过在亚波长尺度上将拓扑光子态与结构合理的材料中的物质进行工程耦合来实现。预期的结果将包括通过2D材料的图案扭曲或扭曲来控制芯片上的光物质波的新方法，而不使用强磁场和电场。这些成果将有利于未来高性能和高能效集成器件的发展。

This project aims to establish a powerful toolkit for topological wave manipulation in photonic systems interfaced with layered 2D materials. This research will address a significant problem of miniaturising photonic components for reliable and compact signal processing. The reduction in size will be achieved by engineering coupling of topological photonic states with matter in judiciously structured materials at subwavelength scales. The expected outcomes will include new methods of controlling light-matter waves on a chip via pattern distortions or twists of the 2D materials, without the use of strong magnetic and electric fields. These outcomes will benefit future development of high performance and energy-efficient integrated devices.