Scalable manufacturing of miniature opto-electronic devices and assemblies

硅光子学（SiPh）是一个新的技术创新领域，其目标是将信息的高能效光传输与硅器件的计算能力紧密结合起来。这种与微电子芯片紧密相连的光通信层范例将增加带宽和数据通信速度，并显著降低当前计算机的功耗。业界的普遍共识是，SiPh技术进入市场的主要技术障碍是封装和组装过程的成本和限制。这项与IBM加拿大公司合作的CRD拨款研究项目将专门解决对SiPh产品成功实施至关重要的关键包装问题。该项目的主要目标是显著改善先进SiPh器件封装中使用的制造工艺，以提供高通量、高成本效益的组装技术。这一目标将通过结合更多的基础研究（材料表征、数值模拟）和制造技术研究（纤维对准和粘合、先进的工艺表征、高效的微组件连接等）来实现。

Silicon photonics (SiPh) is a new field of technological innovation targeting the tight integration of the energy-efficient optical transport of information with the computational power of silicon devices. Such a paradigm of an optical communication layer that is intimately interconnected to microelectronic chips would increase bandwidth and data communication speeds, as well as significantly lower the power consumption of current computers. The general consensus in the industry is that a major technical hurdle to significant market penetration of SiPh technologies is packaging and assembly process costs and limitations. The research project proposed for this CRD grant with IBM Canada will specifically address critical packaging aspects that are important for the successful implementation of SiPh products. The main goal of this project is to significantly improve the manufacturing processes used in the packaging of advanced SiPh devices, to deliver high-throughput, cost-effective assembly technologies. This goal will be achieved by a combination of more fundamental studies (material characterization, numerical modeling) and manufacturing technology research (fiber alignment and bonding, advanced process characterization, efficient microcomponent attachment, etc.).