Numerical and Experimental Studies of Natural Convective Heat Transfer from Horizontal and Near Horizontal Plane Heated Surfaces of Various Shapes

在许多与计算机无关的设备中使用的电子元件需要冷却才能有效地工作。虽然这些设备的冷却不会像计算机系统那样带来严重的困难，但确保足够的热管理可能是一项挑战。这些组件，例如工业测量系统中的组件，由于其高可靠性和成本效益，通常通过自然对流冷却。充分的热管理需要了解在这种设备中出现的情况下存在的自然对流传热率。本研究计划旨在通过为此类冷却系统的设计提供广泛的重要的新基础信息来实现这一目标。考虑的情况是那些发生在现实世界的电子元件冷却的简化模型。组件将被建模为嵌入周围平面的各种形状的扁平加热元件，并且在大多数情况下假设是水平的。

Electronic components used in many non-computer related devices require cooling in order to operate effectively. While cooling of such devices does not pose difficulties as severe as those arising in computer systems, ensuring adequate thermal management can be challenging. Such components, e.g. those in industrial measuring systems, are often cooled by natural convection due to its high reliability and cost effectiveness. Adequate thermal management requires knowledge of the natural convective heat transfer rates that exist in situations arising in such devices. This research program aims to accomplish this by providing a wide range of important new basic information for use in the design of such cooling systems. Situations considered are simplified models of those occurring in real-world electronic component cooling. Components will be modeled as flat heated elements of various shapes embedded in a surrounding flat surface, and in most cases, assumed to be horizontal.