Assembly and adhesion mechanics of 2D materials for scalable production of next-generation electronics

近年来，对更快、更小、更灵活、更敏感的电子产品的需求引发了电子制造业的革命，因为硅基创新几乎达到了其物理极限。为了支持各种转型技术（即自动驾驶汽车、增强现实和物联网），制造具有前所未有性能的下一代电子产品的可行硅替代品备受追捧。虽然业界正在对许多材料进行试验，但由于其优越的物理性能，二维材料（2DM）类是下一代电子产品最有前途的构建模块之一。麦肯锡公司（McKinsey & Company）的商业研究预测，到2030年，2DM电子产品的市场规模将达到700亿美元。然而，由于缺乏高通量和无残留物组装技术，基于2d的电子产品的可扩展生产受到了严重阻碍。原子薄结构需要以可扩展和有效的方式从其生长基板转移到电子组装的目标位置，这需要在纳米尺度上进行先进的操作。需要高通量2DM组装的创新方法，就像操纵乐高积木一样简单，以便将实验室规模的基于2DM的发明转移到市场上。拟议研究计划的长期目标是通过实现其高通量生产，将基于2d的电子产品推向市场。为了实现这一目标，研究计划将分为三个短期目标：1)全面了解2DM接口的粘附机制；2)运用1)中的知识，开发一个新的平台，实现2DM的高通量和无残留转移印刷；3)应用2)中开发的转移印刷平台进行超薄电子元件的大规模组装。这将制定一个闭环研究计划，将基本理解整合到设计和制造新组装技术中，以实现下一代电子产品的可扩展制造。拟议的研究计划将影响下一代超薄膜电子产品的生产，并提供对超薄膜粘附机制的全面理解。未来的高通量组装技术将导致低维材料应用的前所未有的进步，这将使加拿大的电子、汽车、电信和超级计算等行业的公司受益。至少15名高素质人才将在一个跨学科、协作、多样化和支持性的环境中接受培训，他们将获得机械工程、材料科学和纳米技术方面的市场知识和技能，并为他们的未来发展广阔而深入的视野。

Research Background The demand for faster, smaller, more flexible, and more sensitive electronics has triggered the revolution of electronics manufacturing in recent years, as silicon-based innovations have almost reached its physical limitations. Viable alternatives for silicon to make next-generation electronics that provide unprecedented performance are highly sought-after to support a variety of transformational technologies (i.e., autonomous vehicles, augmented reality, and the internet of things). While the industry is experimenting with many materials, the class of two-dimensional materials (2DM) is one of the most promising building blocks for next-generation electronics due to their superior physical properties. Business studies by McKinsey & Company projected a $70 billion market size for 2DM electronics in 2030. However, the scalable production of 2DM-based electronics has been significantly hampered due to the lack of high-throughput and residue-free assembly technologies. The atomically thin structures need to be transferred from their growth substrates to targeted places for electronics assembly in a scalable and efficient manner, which requires advanced manipulation at nanoscale. Innovative approaches for high-throughput assembly of 2DM as easy as manipulating Lego blocks are demanded to transfer the lab-scale 2DM-based inventions to the marketplace. Research Program The long-term objective of the proposed Research Program will aim to transfer 2DM-based electronics to the marketplace by enabling their high-throughput productions. Toward this goal, the research program will be divided into three short-term objectives: 1) develop a comprehensive understanding of the adhesion mechanics at 2DM interfaces; 2) apply the knowledge in 1) to develop a novel platform to enable high-throughput and residue-free transfer printing of 2DM; 3) apply the transfer printing platform developed in 2) to assemble ultrathin electronics in scale. This will formulate a closed-loop research program integrating fundamental understandings into the design and fabrication of novel assembly technologies for scalable manufacturing of next-generation electronics. Impact The proposed research program will impact the production of next-generation ultrathin film-based electronics and provide a comprehensive understanding of the adhesion mechanics of ultrathin films. The prospective high throughput assembly technologies will lead to unprecedented advancements in the applications of low-dimensional materials, which will benefit Canadian companies in industries including electronics, automobiles, telecommunications, and supercomputing. At least 15 highly qualified personnel will be trained within an interdisciplinary, collaborative, diverse, and supportive environment where they will gain marketable knowledge and skills in mechanical engineering, materials science, and nanotechnology and develop a broad and deep sphere of vision for their future.