Site-selective fabrication of quantum nanostructures

量子光子集成电路（QPIC）是一系列量子信息和光子技术的关键，从光量子计算，量子加密，片上量子通信和芯片级量子系统，量子传感等，但迄今为止，还没有报告单片集成的有源和无源量子元件在单个芯片上。以前的研究主要集中在SPS与低损耗SiN/LiNbO 3或绝缘体上硅平台（SOI）的异质集成。然而，使用不同材料的异质集成遭受高的光损耗和集成复杂性。因此，在低损耗WG上使用相同的材料平台开发按需SPS的单片集成在很大程度上解决了上述瓶颈。SPS与低损耗WG的均匀集成将是必不可少的第一步，也是实现多功能和全功能集成QPIC的关键。III族氮化物材料表现出独特的性能，使得使用它们来构建高效的QPIC成为可能。该合作项目旨在制造和展示所有III族氮化物有源和无源量子元件在单个平台中的无缝集成。为此，申请人（Maher教授和Arafin博士）利用其互补的专业知识，技术诀窍，设施和密集的协同作用，旨在提供一个高效和可扩展的平台，用于在室温下使用技术上可行的结构制造确定性的全III族氮化物QPIC。该项目将对整个量子科学和技术界以及量子技术的广泛商业化具有价值。这将是量子光子集成电路发展的一个重要里程碑，可用于广泛的量子应用。目标成果将通过培训量子科学和技术领域的高素质人才，使加拿大量子产业受益。最终会的它还将在学术界和工业界创造职业生涯，并将有助于加强加拿大在新兴量子领域的领先国家之一。

Quantum photonic integrated circuit (QPIC) is critical for a range of quantum information and photonic technologies ranging from optical quantum computing, quantum encryption, on-chip quantum communication and chip scale quantum systems, quantum sensing etc. To date, however, there has been no report on monolithic integration of active and passive quantum elements on a single chip. Previous studies primarily focused on heterogeneous integration of SPS with low-loss SiN/LiNbO3 or silicon on insulator platform (SOI). However, heterogenous integration using dissimilar materials suffers from high optical loss and integration complexity. Therefore, the development of monolithic integration of on-demand SPS on a low-loss WG using same material platform largely solve the afore-mentioned bottleneck. Homogenous integration of SPS with low-loss WG will be the essential first step and crucial to enable versatile and fully functional integrated QPIC. III-nitride materials exhibit unique properties making possible to use them to build efficient QPIC. This collaborative project aims to fabricate and demonstrate seamless integration of all group III-nitride active and passive quantum components in a single platform. To this end, leveraging their complementary expertise, know-how, facilities and intensive synergy, the applicants (Pr. Maher and Dr. Arafin) aim to deliver an efficient and scalable platform for making deterministic all III-nitride QPIC using technologically feasible structure at room temperature. The project will be valuable for the entire quantum science and technology community and the widespread commercialization of quantum technologies. It will be a significant milestone towards the development of quantum photonic integrated circuits for a broad range of quantum applications. The targeted outcomes will benefit the Canadian quantum industry through the training of highly qualified personnel in the fields of quantum science and technology. Eventually. It will also create careers in academia and industry, as well as will contribute to strengthening Canada among the leading nations in the emerging quantum sector.