Volatile or non-volatile switching? Establishing design parameters for metal-contact relays using ON/OFF hysteretic behavior (RT to 300 °C)

Volatile or non-volatile switching? Establishing design parameters for metal-contact relays using ON/OFF hysteretic behavior (RT to 300 °C)
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使用开/关迟滞行为(RT 至 300 °C)建立易失性或非易失性开关的设计参数

DOI:
10.1063/5.0025062
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发表时间:
2021
影响因子:
4
通讯作者:
Pushpapraj Singh
Pushpapraj Singh
中科院分区:
物理与天体物理2区
文献类型:
--
作者:
Sushil Kumar;D. S. Arya;Pushpapraj Singh

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本函介绍了一个系统的评估之间的粘附力亚微米金属(钼)表面的微机电(MEMS)继电器的温度范围(RT至300 °C)。由于粘附力控制静电致动MEMS继电器在电源关闭后是分离还是保持接触,因此,必须知道相互作用电极之间存在的粘附力的量。我们提出了一个理论方案,允许直接提取的粘附力从实验测量的数据(开/关电压),可以精确地确定粘附力从微米到纳米政权。我们的模型确定了这两个属性之间的明确相关性,即,开/关电压和附着力,适用于任何材料系统。通过改变设计参数的实验结果验证了该模型的有效性。结果证实,拉断电压(13.9 V至10.8 V)随温度升高而降低的特性确保了n = 3 × 6和W / L − 1 <$6.67时的大滞后窗口(300 °C时为<$4.7 V),其中n为接触面积尺寸,W / L − 1与可移动电极几何形状有关。该方法可用于各种温度范围的逻辑继电器或存储元件的精确设计。
This Letter presents a systematic evaluation of the adhesion force between sub-micrometer metal (molybdenum) surfaces in microelectromechanical (MEMS) relays for a range of temperatures (RT to 300 °C). As adhesion force controls whether an electrostatic actuated MEMS relay will detach or remain in contact once the power is turned-off, therefore, it is essential to know the amount of adhesion force present between the interacting electrodes. We present a theoretical scheme that allows direct extraction of the adhesion force from experimentally measured data (ON/OFF-voltage) that can precisely determine the adhesion force from the micro- to nanoregime. Our model identified a clear correlation between the two properties, i.e., ON/OFF-voltage and adhesion force and applicable for any arbitrary material systems. The model is validated by experimental results with varying design parameters. The results confirm that the decreasing nature of pull-OFF voltage (13.9 V to 10.8 V) with increasing temperature ensures a large hysteresis window (∼4.7 V at 300 °C) for n = 3  × 6 and W / L − 1 ∼ 6.67, where n is the contact-area dimension and W / L − 1 is related to movable electrode geometry. The proposed method can be adopted for the precise designing of various logic relays or memory elements suitable for a wide temperature range.
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发表时间: 2019-09
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发表时间: 2018
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