A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
A 10 kV SiC Power Module Stacked Substrate Design with Patterned Middle-layer for Partial Discharge Reduction
复制标题
具有图案化中间层以减少局部放电的 10 kV SiC 功率模块堆叠基板设计
DOI:
10.1109/apec43580.2023.10131485
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发表时间:
2023
期刊:
影响因子:
--
通讯作者:
Mantooth, H. Alan
中科院分区:
文献类型:
--
作者:
Li, Xiaoling;Chen, Hao;Paul, Riya;Mukherjee, Shilpi;Du, Xia;Cuzner, Robert;Song, Xiaoqing;Zhao, Yue;Mantooth, H. Alan
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DOI:
10.1109/ecce47101.2021.9595515
发表时间:
2021-10
期刊:
2021 IEEE Energy Conversion Congress and Exposition (ECCE)
影响因子:
--
作者:
A. Mirza;A. Emon;Sama Salehi Vala;F. Luo
通讯作者:
A. Mirza;A. Emon;Sama Salehi Vala;F. Luo
DOI:
10.1109/tdei.2010.5539704
发表时间:
2010-08
影响因子:
3.1
作者:
Ningyan Wang;I. Cotton;J. Robertson;S. Follmann;K. Evans;D. Newcombe
通讯作者:
Ningyan Wang;I. Cotton;J. Robertson;S. Follmann;K. Evans;D. Newcombe
DOI:
--
发表时间:
2012
期刊:
2012 7th International Conference on Integrated Power Electronics Systems (CIPS)
影响因子:
--
作者:
Olaf Hohlfeld;R. Bayerer;Th. Hunger;Hans Hartung
通讯作者:
Hans Hartung
DOI:
10.1109/icep.2016.7486885
发表时间:
2016
期刊:
2016 International Conference on Electronics Packaging (ICEP)
影响因子:
--
作者:
U. Waltrich;C. F. Bayer;M. Reger;A. Meyer;X. Tang;A. Schletz
通讯作者:
A. Schletz
DOI:
10.1109/compel.2018.8459973
发表时间:
2018
期刊:
2018 IEEE 19th Workshop on Control and Modeling for Power Electronics (COMPEL)
影响因子:
--
作者:
Shilpi Mukherjee;Tristan M. Evans;B. Narayanasamy;Quang Le;A. Emon;A. Deshpande;F. Luo;Yarui Peng;S. Pytel;T. Vrotsos;A. Mantooth
通讯作者:
A. Mantooth