Lab-on-CMOS integration of microfluidics and electrochemical sensors.

Lab-on-CMOS integration of microfluidics and electrochemical sensors.
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DOI:
10.1039/c3lc50437a
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发表时间:
2013-10-07
期刊:
影响因子:
6.1
通讯作者:
Mason AJ
Mason AJ
中科院分区:
工程技术1区
文献类型:
--
作者:
Huang Y;Mason AJ

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介绍了一种用于电化学微系统的CMOS-微流控集成方案。将CMOS芯片嵌入到微机械加工的硅载体中。通过将CMOS芯片和载体表面平整到100 nm以内,实现了适用于光刻的扩展的无障碍表面。薄膜金属平面互连被微制造以将CMOS焊盘桥接到载体的周边,留下用于集成微流体结构的平坦且光滑的表面。采用芯片-载体组装方案,在CMOS集成电路上构建了一个包含SU-8微流控混合器和跨微电极检测通道的模型装置。通过在多通道微流体内同时进行样品稀释和电化学检测实验来验证微流体结构和CMOS上电极的功能完整性。这种CMOS实验室集成工艺能够实现高封装密度,适用于晶圆级批量生产,并为将CMOS芯片上传感器的性能优势与芯片实验室平台联合收割机相结合提供了新的机会。
This paper introduces a CMOS-microfluidics integration scheme for electrochemical microsystems. A CMOS chip was embedded into a micro-machined silicon carrier. By leveling the CMOS chip and carrier surface to within 100 nm, an expanded obstacle-free surface suitable for photolithography was achieved. Thin film metal planar interconnects were microfabricated to bridge CMOS pads to the perimeter of the carrier, leaving a flat and smooth surface for integrating microfluidic structures. A model device containing SU-8 microfluidic mixers and detection channels crossing over microelectrodes on a CMOS integrated circuit was constructed using the chip-carrier assembly scheme. Functional integrity of microfluidic structures and on-CMOS electrodes was verified by a simultaneous sample dilution and electrochemical detection experiment within multi-channel microfluidics. This lab-on-CMOS integration process is capable of high packing density, is suitable for wafer-level batch production, and opens new opportunities to combine the performance benefits of on-CMOS sensors with lab-on-chip platforms.
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