Three-dimensional mesostructures as high-temperature growth templates, electronic cellular scaffolds, and self-propelled microrobots.
Three-dimensional mesostructures as high-temperature growth templates, electronic cellular scaffolds, and self-propelled microrobots.
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三维介观结构作为高温生长模板、电子细胞支架和自驱动微型机器人
DOI：
10.1073/pnas.1713805114
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发表时间：
2017-11-07
影响因子：
11.1
通讯作者：
Rogers JA
中科院分区：
文献类型：
--
作者：
Yan Z;Han M;Shi Y;Badea A;Yang Y;Kulkarni A;Hanson E;Kandel ME;Wen X;Zhang F;Luo Y;Lin Q;Zhang H;Guo X;Huang Y;Nan K;Jia S;Oraham AW;Mevis MB;Lim J;Guo X;Gao M;Ryu W;Yu KJ;Nicolau BG;Petronico A;Rubakhin SS;Lou J;Ajayan PM;Thornton K;Popescu G;Fang D;Sweedler JV;Braun PV;Zhang H;Nuzzo RG;Huang Y;Zhang Y;Rogers JA
在微/纳米制造中开发先进的3D设计激发了各种领域的潜在应用，包括生物医学工程、超材料、电子、机电元件等。这里提出的结果为材料界广泛而当前感兴趣的领域提供了有利的概念——形成复杂的3D微/纳米结构的策略，以及使用它们指导合成材料和生物系统生长的方法。与3D打印、多光子光刻和应力诱导弯曲等更传统的方法相比，这些想法提供了在质量上不同的能力——结果可以在最先进的材料中获得主动式和被动式3D介观结构，作为独立系统或与几乎任何类型的支撑基板集成。最近的研究表明，预应变弹性体衬底中的应力释放过程可以指导先进材料中复杂的3D微/纳米结构的组装。报告的应用示例包括软电子元件，可调谐电磁和光学器件，振动测量平台和其他不寻常的技术，每种技术都通过独特的工程3D架构实现。这些系统的一个显著缺点是，弹性体基板虽然对装配过程至关重要，但在操作温度和尺寸稳定性水平方面可能会施加重大的工程限制；它们也阻止了独立形式的3D结构的实现。在这里，我们介绍了界面光聚合，非线性力学和物理转移的概念，绕过了这些限制。研究结果使3D介观结构能够以完全或部分独立的形式存在，并具有集成到几乎任何类型的基底上的额外能力，从平面硬无机材料到纹理软生物组织，所有这些都通过理论建模定量描述的机制。这些想法的实例包括它们在3D结构中的应用，作为AgCl-KCl共晶的有组织薄片的模板化生长框架和来自气相前体的WSe2原子层，作为形成背根神经节（DRG）神经网络的开放式结构电子支架，以及作为具有几何控制动力学的3D微游泳推进系统的催化剂支持。综上所述，这些方法在3D微/纳米制造中建立了一套可行的选择，超出了现有替代方案的范围。
Significance Exploiting advanced 3D designs in micro/nanomanufacturing inspires potential applications in various fields including biomedical engineering, metamaterials, electronics, electromechanical components, and many others. The results presented here provide enabling concepts in an area of broad, current interest to the materials community––strategies for forming sophisticated 3D micro/nanostructures and means for using them in guiding the growth of synthetic materials and biological systems. These ideas offer qualitatively differentiated capabilities compared with those available from more traditional methodologies in 3D printing, multiphoton lithography, and stress-induced bending––the result enables access to both active and passive 3D mesostructures in state-of-the-art materials, as freestanding systems or integrated with nearly any type of supporting substrate. Recent work demonstrates that processes of stress release in prestrained elastomeric substrates can guide the assembly of sophisticated 3D micro/nanostructures in advanced materials. Reported application examples include soft electronic components, tunable electromagnetic and optical devices, vibrational metrology platforms, and other unusual technologies, each enabled by uniquely engineered 3D architectures. A significant disadvantage of these systems is that the elastomeric substrates, while essential to the assembly process, can impose significant engineering constraints in terms of operating temperatures and levels of dimensional stability; they also prevent the realization of 3D structures in freestanding forms. Here, we introduce concepts in interfacial photopolymerization, nonlinear mechanics, and physical transfer that bypass these limitations. The results enable 3D mesostructures in fully or partially freestanding forms, with additional capabilities in integration onto nearly any class of substrate, from planar, hard inorganic materials to textured, soft biological tissues, all via mechanisms quantitatively described by theoretical modeling. Illustrations of these ideas include their use in 3D structures as frameworks for templated growth of organized lamellae from AgCl–KCl eutectics and of atomic layers of WSe2 from vapor-phase precursors, as open-architecture electronic scaffolds for formation of dorsal root ganglion (DRG) neural networks, and as catalyst supports for propulsive systems in 3D microswimmers with geometrically controlled dynamics. Taken together, these methodologies establish a set of enabling options in 3D micro/nanomanufacturing that lie outside of the scope of existing alternatives.
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影响因子：
56.9
作者：
Noorduin, Wim L.;Grinthal, Alison;Aizenberg, Joanna
通讯作者：
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影响因子：
17.1
作者：
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影响因子：
9.5
作者：
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Nuzzo RG
影响因子：
6.1
作者：
Ravula, Surendra K.;McClain, Maxine A.;Frazier, A. Bruno
通讯作者：
Frazier, A. Bruno
影响因子：
16.6
作者：
Jang KI;Li K;Chung HU;Xu S;Jung HN;Yang Y;Kwak JW;Jung HH;Song J;Yang C;Wang A;Liu Z;Lee JY;Kim BH;Kim JH;Lee J;Yu Y;Kim BJ;Jang H;Yu KJ;Kim J;Lee JW;Jeong JW;Song YM;Huang Y;Zhang Y;Rogers JA
通讯作者：
Rogers JA