Slow positron beam study of nitrogen implanted CZ-Si subjected to rapid thermal processing

Slow positron beam study of nitrogen implanted CZ-Si subjected to rapid thermal processing
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快速热处理的氮注入直拉硅的慢正电子束研究

DOI:
10.1016/j.apsusc.2007.01.125
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发表时间:
2007-06
影响因子:
6.7
通讯作者:
--
中科院分区:
材料科学1区
文献类型:
--
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本实验在室温下以100keV、注量为5×1015N2+/cm2将氮离子注入CZ硅片中,然后在不同温度下进行快速热处理(RTP)。对慢速正电子束进行单探测器多普勒展宽和重合多普勒展宽测量,以表征注入硅和 RTP 处理样品中的缺陷。研究发现,氮注入产生的氮空位复合物(N-Vsi)和氧空位复合物(O-Vsi)在退火时扩散回样品表面。但N-Vsi和O-Vsi相互补充并对正电子湮没特性产生总的影响。注入样品和650℃、750℃RTP结果表明,N-Vsi优于O-Vsi,使得S参数增加; 850℃以上退火后O-Vsi起主导作用,使S参数下降。
In this experiment, nitrogen ions were implanted into CZ-silicon wafer at 100keV at room temperature with the fluence of 5×1015N2+/cm2, followed by rapid thermal processing (RTP) at different temperatures. The single detector Doppler broadening and coincidence Doppler broadening measurements on slow positron beam were carried out to characterize the defects in the as-implanted silicon and RTP-treated samples. It is found that both nitrogen-vacancy complexes (N-Vsi) and oxygen-vacancy complexes (O-Vsi) produced by nitrogen implantation diffuse back to the sample surface upon annealing. But the N-Vsi and the O-Vsi complete with each other and give a summed effect on positron annihilation characteristics. It is shown that the N-Vsi win out the O-Vsi in as-implanted sample and by RTP at 650°C, 750°C, which make the S-parameter increase; O-Vsi plays a dominant role after annealing above 850°C, which makes the S parameter decrease.
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