A novel thermal-mechanical model and the characteristics of interfacial stress in the laminated structure for flexible electronics
A novel thermal-mechanical model and the characteristics of interfacial stress in the laminated structure for flexible electronics
复制标题
柔性电子叠层结构中新型热力模型及界面应力特征
DOI：
10.1088/1361-6463/ac30b9
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发表时间：
2021-11
期刊：
影响因子：
--
通讯作者：
Rui Yan
中科院分区：
文献类型：
--
作者：
Xu Liu;Yuanying Qiu;Yuan Wei;Rui Yan
柔性电子产品因其在众多基础和新兴领域的巨大潜在用途而引起了迅速增长的兴趣。然而，在界面应力和由此产生的柔性电子产品故障方面，仍然存在一些紧迫的问题，特别是在热和机械负载下粘附到软聚合物基材上的硬膜异质层压板。本研究重点研究代表性层状结构的界面应力，即硅薄膜通过塑料聚对苯二甲酸乙二醇酯基板粘合到软聚二甲基硅氧烷上。本文建立了这种柔性结构的新型热力耦合模型，该模型呈现了界面剪切应力的基本特征。此外，在热载荷和机械载荷下，通过使用微分求积法将解析解与数值结果相结合来研究典型情况。此外，还定量探讨了热载荷和机械载荷、材料和几何参数对界面剪切应力的影响。还提出了减轻压力的有针对性的策略。总之，热力模型和应用案例分析有助于提高柔性层合结构的界面可靠性设计。
Flexible electronics have attracted rapidly growing interest owing to their great potential utility in numerous fundamental and emerging fields. However, there are urgent issues that remain as pending challenges in the interfacial stress and resulting failures of flexible electronics, especially for heterogeneous laminates of hard films adhered to soft polymer substrates under thermal and mechanical loads. This study focuses on the interfacial stress of a representative laminated structure, that is, the Si film is adhesively bonded to soft polydimethylsiloxane with a plastic polyethylene terephthalate substrate. An novel thermal-mechanical coupling model for this flexible structure is established in this paper, which presents the essential characteristics of interfacial shear stress. In addition, under thermal and mechanical loads, a typical case is investigated by combining an analytical solution with numerical results using the differential quadrature method. Furthermore, thermal and mechanical loads, material and geometry parameters are quantitatively explored for their influences on the interfacial shear stress. Targeted strategies for decreasing stress are also suggested. In conclusion, the thermal-mechanical model and application case analyses contribute to enhancing the design of interfacial reliability for flexible laminated structures.
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影响因子：
2.8
作者：
E. Suhir
通讯作者：
E. Suhir
影响因子：
10
作者：
Zhang Y;Webb RC;Luo H;Xue Y;Kurniawan J;Cho NH;Krishnan S;Li Y;Huang Y;Rogers JA
通讯作者：
Rogers JA
DOI：
10.1016/j.ijheatmasstransfer.2018.07.105
发表时间：
2018-12
影响因子：
5.2
作者：
Yun Cui;Yuhang Li;Y. Xing
通讯作者：
Yun Cui;Yuhang Li;Y. Xing
DOI：
10.1016/j.compositesb.2018.11.086
发表时间：
2019-05
期刊：
Composites Part B: Engineering
影响因子：
--
作者：
Jiayu Wu;Jiayu Wu;Hong Yuan;Long-yuan Li
通讯作者：
Jiayu Wu;Jiayu Wu;Hong Yuan;Long-yuan Li
影响因子：
6.4
作者：
Cui, Yun;Li, Yuhang;Song, Jizhou
通讯作者：
Song, Jizhou