Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology
Microstructure evolution and properties of rapidly solidified Au-20Sn eutectic solder prepared by single-roll technology
复制标题
单辊技术制备快凝Au-20Sn共晶焊料的组织演变及性能
DOI：
10.1016/j.jallcom.2018.12.073
复制
发表时间：
2019-04
影响因子：
6.2
通讯作者：
Shangyu Huang
中科院分区：
文献类型：
--
作者：
Shengfa Liu;Dongxiao Zhang;Jieran Xiong;Chen Chen;Tianjie Song;Li Liu;Shangyu Huang
目前芯片级Au-Sn焊料生产工艺十分复杂，为简化工艺同时提高焊料质量，采用单辊快速凝固技术制备Au-20Sn焊带。研究了焊料的微观结构演变、成分分布、相组成、熔化特性、润湿性和机械性能。快速凝固的Au-20Sn焊料合金由少量初生δ'-Au5Sn枝晶和共晶结构（δ'-Au5Sn+δ-AuSn）组成。退火过程中组织细化，成分分布均匀，没有新相形成。随着Sn元素从δ'-Au5Sn相扩散到δ-AuSn相中，δ'-Au5Sn相发生分解，δ-AuSn相长大并分布在基体中。轧制后，δ-AuSn相沿薄带的伸长方向伸长，元素进一步偏析。最终，与铸轧Au-20Sn焊料相比，熔化范围更窄，焊点的润湿性和剪切强度得到改善。
The current chip-level Au-Sn solder production process is very complex, to simplify the process while improving the quality of the solder, Au-20Sn solder ribbon was prepared by single-roll rapid solidification technology. The microstructure evolution, composition distribution, phase composition, melting characteristics, wettability and mechanical properties of the solder were studied. The rapidly solidified Au-20Sn solder alloy consisted of a small amount of primary ζ′-Au5Sn dendrites and eutectic structure (ζ′-Au5Sn+δ-AuSn). The microstructure was refined and the components were evenly distributed, while no new phase was formed during the annealing. With Sn element diffused into the δ-AuSn phase from the ζ′-Au5Sn phase, the ζ′-Au5Sn phase was decomposed and the δ-AuSn phase grew up and distributed in the matrix. After rolling, the δ-AuSn phase was elongated along the elongation direction of the ribbon, and the elements were further segregated. Ultimately, compared to the cast-rolling Au-20Sn solder, the melting range was narrower, and the wettability and the shear strength of the solder joint improved.
登录
查看更多内容
影响因子：
2.2
作者：
Qingbiao Tan;C. Deng;Y. Mao;G. He
通讯作者：
Qingbiao Tan;C. Deng;Y. Mao;G. He
DOI：
10.1007/s10854-013-1490-x
发表时间：
2013-09
期刊：
Journal of Materials Science: Materials in Electronics
影响因子：
--
作者：
Yanxia Jing;G. Sheng;Zhenhua Huang;Guoji Zhao
通讯作者：
Yanxia Jing;G. Sheng;Zhenhua Huang;Guoji Zhao
影响因子：
6.2
作者：
Z. X. Zhu;Chung Chen Li;L. Liao;Chun-Kai Liu;C. Kao
通讯作者：
Z. X. Zhu;Chung Chen Li;L. Liao;Chun-Kai Liu;C. Kao
DOI：
10.1016/j.msea.2005.10.040
发表时间：
2006-02
影响因子：
6.4
作者：
Chengyi Xu;H. Y. Wang;F. Qiu;Y. F. Yang;Q. Jiang
通讯作者：
Chengyi Xu;H. Y. Wang;F. Qiu;Y. F. Yang;Q. Jiang
影响因子：
6
作者：
Xinkun Zhu;Xinghang Zhang;Huamiao Wang;A. Sergueeva;A. Mukherjee;R. Scattergood;J. Narayan;C. Koch
通讯作者：
Xinkun Zhu;Xinghang Zhang;Huamiao Wang;A. Sergueeva;A. Mukherjee;R. Scattergood;J. Narayan;C. Koch