Thermal Degradation of Electroplated Nickel Thermal Microactuators
Thermal Degradation of Electroplated Nickel Thermal Microactuators
复制标题
电镀镍热微执行器的热降解
DOI：
10.1109/jmems.2009.2034394
复制
发表时间：
2009
影响因子：
2.7
通讯作者：
Luo J
中科院分区：
文献类型：
--
作者：
Luo J
本文研究了电镀镍热致动器的热退化问题。所研究的致动器提供了约为100%的最大位移。20 μ m，平均温度为~ 450摄氏度，这是远远低于典型的硅基微致动器。然而，位移的大小强烈地依赖于所施加的脉冲信号的频率和电压幅度。在最高温度低至240摄氏度时观察到回弯。向前和向后的位移都随着所施加的功率增加到60 mW的值而增加;进一步增加导致两种位移的幅度减小。扫描电子显微镜清楚地表明，镍梁开始变形，并改变其形状在这个临界功率水平。压应力是镍堆积的原因，而在移除电流时产生的拉伸应力是器件热臂最热部分处的颈缩的原因。能量分散X射线衍射分析还揭示了焦耳加热引起的Ni结构的严重氧化。塑性变形和氧化的组合是所观察到的热降解的原因。结果表明，镍热微致动器应在低于200摄氏度，以避免热降解。
In this paper, the thermal degradation of laterally operating thermal actuators made from electroplated nickel has been studied. The actuators investigated delivered a maximum displacement of ca. 20 mum at an average temperature of ~ 450degC , which is much lower than that of typical silicon-based microactuators. However, the magnitude of the displacement strongly depended on the frequency and voltage amplitude of the pulse signal applied. Back bending was observed at maximum temperatures as low as 240degC. Both forward and backward displacements increase as the applied power was increased up to a value of 60 mW; further increases led to reductions in the magnitudes of both displacements. Scanning electron microscopy clearly showed that the nickel beams began to deform and change their shape at this critical power level. Compressive stress is responsible for nickel pileup, while tensile stresses, generated upon removing the current, are responsible for necking at the hottest section of the hot arm of the device. Energy dispersive X-ray diffraction analysis also revealed the severe oxidation of Ni structure induced by Joule heating. The combination of plastic deformation and oxidation was responsible for the observed thermal degradation. Results indicate that nickel thermal microactuators should be operated below 200degC to avoid thermal degradation.
登录
查看更多内容
DOI：
--
发表时间：
1996
期刊：
Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components
影响因子：
--
作者：
J. R. Reid;V. Bright;J. Comtois
通讯作者：
J. Comtois
影响因子：
3.9
作者：
Luo, J. K.;Pritschow, M.;Milne, W. I.
通讯作者：
Milne, W. I.
DOI：
--
发表时间：
1999
期刊：
IEEE/LEOS International Conference on Optical MEMS
影响因子：
--
作者：
T. Moulton;G. K. Ananthasuresh
通讯作者：
G. K. Ananthasuresh
三种具有绝缘梁约束的平面结构微弹簧电热执行器
DOI：
--
发表时间：
2005
期刊：
影响因子：
--
作者：
J. K. Luo;A. Flewitt;S. Spearing;N. Fleck;W. I. Milne
通讯作者：
W. I. Milne
表面微机械热执行器的循环疲劳测试
DOI：
--
发表时间：
1998
期刊：
IEEE/LEOS International Conference on Optical MEMS
影响因子：
--
作者：
R. Conant;R. Muller
通讯作者：
R. Muller