3D Photofixation Lithography in Diels-Alder Networks.
3D Photofixation Lithography in Diels-Alder Networks.
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DOI：
10.1002/marc.201200599
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发表时间：
2012-12-21
影响因子：
4.6
通讯作者：
Bowman, Christopher N.
中科院分区：
文献类型：
--
作者：
Adzima, Brian J.;Kloxin, Christopher J.;DeForest, Cole A.;Anseth, Kristi S.;Bowman, Christopher N.
3D结构是在最初由Diels-Alder反应形成的交联聚合物中写入和开发的。与传统的液体抗蚀剂不同，小的特征不能沉积，因为可逆交联起支撑作用，并且材料的模量在室温下在MPa范围内。然而，通过加热将聚合物解聚成低粘度单体的混合物的材料，可以容易地去除支撑结构。使用双光子技术将复杂形状写入聚合物网络中，以空间控制光引发和随后的硫醇-烯反应，从而选择性地将Diels-Alder加合物转化为不可逆交联。
3D structures were written and developed in a crosslinked polymer initially formed by a Diels–Alder reaction. Unlike conventional liquid resists, small features cannot sediment, as the reversible crosslinks function as a support, and the modulus of the material is in the MPa range at room temperature. The support structure, however, can be easily removed by heating the material which depolymerizes the polymer into a mixture of low-viscosity monomers. Complex shapes were written into the polymer network using two-photon techniques to spatially control the photoinitiation and subsequent thiol–ene reaction to selectively convert the Diels–Alder adducts into irreversible crosslinks.
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