Precipitation induced crack healing in a Ti2SnC ceramic in vacuum

Precipitation induced crack healing in a Ti2SnC ceramic in vacuum
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真空中 Ti2SnC 陶瓷的沉淀诱导裂纹愈合

DOI:
10.1016/j.ceramint.2017.02.120
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发表时间:
2017-06
影响因子:
5.2
通讯作者:
Yang Zhou
Yang Zhou
中科院分区:
材料科学1区
文献类型:
--
作者:
Shibo Li;Linquan Zhang;Wenbo Yu;Yang Zhou

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自愈合陶瓷能够在高温氧化环境中通过氧化修复机制修复裂纹,恢复原有的性能和功能。然而,当陶瓷在真空或低氧分压的惰性气氛中使用时,氧化修复是不可能的。到目前为止,在真空或惰性气氛中修复裂纹的工作还很少。本文报道了Ti2SnC陶瓷在真空中用沉淀诱导修复机制修复裂纹。Ti2SnC中热冲击产生的裂纹在真空中只需1小时,在800℃以上的温度下就能完全由金属锡填充。修复后材料的电导率完全恢复,甚至超过了初始电导率。这项工作可能会为研究陶瓷在低氧分压环境下的裂纹愈合行为带来新的浪潮。
Self-healing ceramics are able to heal cracks through an oxidative healing mechanism at high temperature in oxidizing environments with the recovery of original performance and functionality. However, the oxidation induced repair may be impossible when the ceramics are used in vacuum or inert atmospheres with low oxygen partial pressures. So far little work has been done on crack healing in vacuum or inert atmospheres. Here we report on the crack healing of a Ti2SnC ceramic in vacuum by a precipitation induced repair mechanism. Cracks induced by thermal shock in Ti2SnC are completely filled by only metallic Sn at temperatures above 800 °C for only 1 h in vacuum. The electrical conductivity of healed materials is fully recovered, and it even exceeds the initial conductivity. This work might bring a new wave of research on crack healing behavior of ceramics in low oxygen partial pressure environments.
DOI: 10.1002/9783527625376
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