Fabrication of a novel SEM microgripper by electrochemical and FIB techniques
Fabrication of a novel SEM microgripper by electrochemical and FIB techniques
复制标题
通过电化学和 FIB 技术制造新型 SEM 微夹具
DOI:
10.1088/0960-1317/20/1/015028
复制
发表时间:
2010
影响因子:
2.3
通讯作者:
Briston K
中科院分区:
文献类型:
--
作者:
Briston K
A novel type of microgripper has been developed that uses combined electrochemical etching and focused ion beam milling techniques to fabricate microgripper end-effecters from a single piece of metal wire. This ensures that the two end-effecters have well-aligned faces, can be made in a relatively simple manner to a flexible/chosen design and can be made from a wide range of materials. The wire used here is tungsten which is easy to etch and allows the gripping force to be maximized. Independent electrical connections to each of the end-effecters allow them to be grounded to prevent charging in the SEM beam and give the option of applying a voltage across an object that is picked up. Actuation of the gripper is accomplished using a trimorph piezo bender actuator giving very good resolution (typically∼ 170 nm V− 1) and a maximum possible span range of over 20 µm. The gripper has been successfully demonstrated in picking up and placing individual copper microspheres and carbon nanotubes in situ in the SEM.
登录
查看更多内容
DOI:
--
发表时间:
2006
期刊:
影响因子:
--
作者:
M. Blideran;M. Fleischer;W. Henschel;D. Kern;Jochen Sterr;K. Schock;S. Kleindiek;M. Langer;K. Löffler;F. Grauvogel
通讯作者:
F. Grauvogel
DOI:
--
发表时间:
2005
期刊:
影响因子:
--
作者:
T. Kamino;T. Yaguchi;T. Hashimoto;T. Ohnishi;K. Umemura
通讯作者:
K. Umemura
DOI:
--
发表时间:
2006
期刊:
影响因子:
--
作者:
M. Blideran;Günter Bertsche;W. Henschel;D. Kern
通讯作者:
D. Kern
影响因子:
2.2
作者:
Y. Nakayama
通讯作者:
Y. Nakayama
DOI:
--
发表时间:
2008
期刊:
影响因子:
--
作者:
Yong Peng;I. Luxmoore;M. Forster;A. Cullis;B. Inkson
通讯作者:
B. Inkson