The inactivation of Staphylococcus aureus biofilms using low-power argon plasma in a layer-by-layer approach.
The inactivation of Staphylococcus aureus biofilms using low-power argon plasma in a layer-by-layer approach.
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DOI:
10.1080/08927014.2014.995643
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发表时间:
2015
期刊:
影响因子:
2.7
通讯作者:
Liang JF
中科院分区:
文献类型:
--
作者:
Traba C;Liang JF
The direct application of low power argon plasma for the decontamination of pre-formed Staphylococcus aureus biofilms on various surfaces was examined. Distinct chemical/physical properties of reactive species found in argon plasmas generated at different wattages all demonstrated very potent but very different anti-biofilm mechanisms of action. An in depth analysis of results showed that: (1) the different reactive species produced in each plasma demonstrated specific antibacterial and/or anti-biofilm activity, and 2) the commonly associated etching effect could be manipulated and even controlled, depending on experimental conditions. Under optimal experimental parameters, bacterial cells in S. aureus biofilms were killed (>99.9%) by plasmas within 10 min of exposure and no bacteria nor biofilm re-growth from argon discharge gas treated biofilms was observed for 150 h. The decontamination ability of plasmas for the treatment of biofilm related contaminations on various materials was confirmed and an entirely novel layer-by-layer decontamination approach was designed and examined.
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影响因子:
2.7
作者:
Traba C;Liang JF
通讯作者:
Liang JF
影响因子:
3.8
作者:
Conrads, H;Schmidt, M
通讯作者:
Schmidt, M
影响因子:
3.2
作者:
Moreau, S;Moisan, M;Yahia, L
通讯作者:
Yahia, L
影响因子:
4
作者:
Perni, Stefano;Shama, Gilbert;Kong, M. G.
通讯作者:
Kong, M. G.
影响因子:
6.4
作者:
PETERS, G;LOCCI, R;PULVERER, G
通讯作者:
PULVERER, G