Activation of Al2O3 surface passivation of silicon: Separating bulk and surface effects

Activation of Al2O3 surface passivation of silicon: Separating bulk and surface effects
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硅 Al2O3 表面钝化的活化:分离体效应和表面效应

DOI:
10.1016/j.apsusc.2023.158786
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发表时间:
2024
影响因子:
6.7
通讯作者:
Grant N
Grant N
中科院分区:
材料科学1区
文献类型:
--
作者:
Grant N

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了解氧化铝 (Al2O3) 薄膜产生的表面钝化对于需要可忽略表面复合的硅基太阳能电池和器件具有重要意义。本研究旨在了解在原子层沉积的 Al2O3 活化过程中发生的竞争性体寿命和表面寿命效应。我们证明,无论退火环境如何,在 ~ 450 °C 下激活时,n 型和 p 型硅都可以实现最大钝化。在使用基于超强酸的技术剥离 Al2O3 薄膜并重新钝化表面后,我们发现浮区硅片和直拉硅片的整体寿命在退火温度 > 450 °C 时会降低。通过考虑这种整体寿命下降,我们证明与 Al2O3 相关的化学钝化成分在 450─500 °C 的活化温度下保持稳定,实现了 n 型和 p 型硅的 SRV < 1 cm/s。结合热稳定性,我们发现 3-30 nm 范围内的薄膜在 450 °C 退火时保持 < 1 cm/s 的 SRV。通过原子级能量色散X射线分析,我们证明沉积后界面具有Si/SiO2/Al2O3结构。在 > 300 °C 下激活后,由于铝扩散到薄氧化硅层中,界面变成 Si/SixAlyO2/Al2O3。
Understanding surface passivation arising from aluminium oxide (Al2O3) films is of significant relevance for silicon-based solar cells and devices that require negligible surface recombination. This study aims to understand the competing bulk and surface lifetime effects which occur during the activation of atomic layer deposited Al2O3. We demonstrate that maximum passivation is achieved onn- andp-type silicon with activation at ∼ 450 °C, irrespective of annealing ambient. Upon stripping the Al2O3films and re-passivating the surface using a superacid-based technique, we find the bulk lifetime of float-zone and Czochralski silicon wafers degrade at annealing temperatures > 450 °C. By accounting for this bulk lifetime degradation, we demonstrate that the chemical passivation component associated with Al2O3remains stable at activation temperatures of 450─500 °C, achieving an SRV of < 1 cm/s onn- andp-type silicon. In conjunction with the thermal stability, we show that films in the range of 3–30 nm maintain an SRV of < 1 cm/s when annealed at 450 °C. From atomic-level energy dispersive X-ray analysis, we demonstrate that, post deposition, the interface has a structure of Si/SiO2/Al2O3. After activation at > 300 °C, the interface becomes Si/SixAlyO2/Al2O3due to diffusion of aluminium into the thin silicon oxide layer.
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