Abnormal accumulation and rotation of Sn in Cu-cored Sn solder joints under current stressing
Abnormal accumulation and rotation of Sn in Cu-cored Sn solder joints under current stressing
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电流应力作用下铜芯锡焊点中锡的异常堆积和旋转
DOI：
10.1016/j.matchemphys.2012.08.037
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发表时间：
2012-10
影响因子：
4.6
通讯作者：
Wu, Ping1, 2
中科院分区：
文献类型：
--
作者：
Mu, Wenkai1, 2;Zhou, Wei1, 2;Li, Baoling1, 2;Wu, Ping1, 2
研究了Cu芯Sn焊点在1.3 × 104 A cm-2电流密度下的电迁移行为。通过有限元模拟得到了焊点中电流密度的分布。Cu芯主要被选择作为电流通量的路径，因为其具有比Sn低的电阻率。结果表明，大部分的形貌变化都发生在电流拥挤的区域，实验结果与模拟结果基本一致。考虑到特殊的结构，Cu芯在界面处为焊点提供了额外的电极，导致Sn在阴极和阳极处的异常积聚和旋转。在Cu芯焊点中，IMC的生长相当缓慢。
The electromigration behavior of Cu-cored Sn solder joints under a current density of 1.3 × 104A cm−2was investigated in this work. Finite element simulation was performed to obtain the distribution of the current density in the solder joint. The Cu core was chosen primarily as the path for current flux, as it has a lower resistivity than Sn. It is found that most morphology changes appeared at the regions where current crowding occurred, demonstrating the consistency of the experimental and simulation results. Taking the special structure into consideration, the Cu core contributed additional electrodes to the solder joint at the interfaces, resulting in abnormal accumulation and rotation of Sn at both the cathode and the anode. The IMC growth was quite slow in the Cu-cored solder joint.
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影响因子：
4.5
作者：
Yunsung Kim;Hyelim Choi;Hyo-Byeang Lee;Dongjun Shin;Jeong-Geun Moon;H. Choe
通讯作者：
Yunsung Kim;Hyelim Choi;Hyo-Byeang Lee;Dongjun Shin;Jeong-Geun Moon;H. Choe
影响因子：
4
作者：
Yeh, ECC;Choi, WJ;Balkan, H
通讯作者：
Balkan, H
影响因子：
--
作者：
Y. Kohara;Toshio Saeki;K. Uenishi;K. Kobayashi;I. Shohji;Masaharu Yamamoto
通讯作者：
Y. Kohara;Toshio Saeki;K. Uenishi;K. Kobayashi;I. Shohji;Masaharu Yamamoto
影响因子：
56.9
作者：
Wang, CP;Liu, XJ;Ishida, K
通讯作者：
Ishida, K
影响因子：
3.9
作者：
Daobin Mu;K. Kondo;Junpei Maeda
通讯作者：
Daobin Mu;K. Kondo;Junpei Maeda